DRAM revenue surges 30% in Q4 2025 amid price rally

Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q 2025.

Extended OLED partnership strengthens display innovation

Universal Display has extended its long-term OLED material supply and license agreements with LG Display.

A female perspective on the food industry workplace

From ADM, Olive Tang, VP of Flavors, APAC, and Jingting Li, Talent Acquisition Director, APAC talk about their experiences, perspectives and the opportunities for women in the food industry.

Edge computing spend to hit $450B by 2029

Edge AI's impact is already visible across industrial automation, smart retail, connected vehicles, and next‑generation healthcare.

China drives global smartwatch growth in 2025

Global smartwatch shipments rebounded in 2025, growing by 4% year-on-year, according to Counterpoint Research.

200V BCD process boosts automotive & AI power ICs

A newly introduced 200V bipolar-CMOS-DMOS (BCD) process technology is designed to advance power ICs for automotive and AI applications. Supporting higher voltages with improved efficiency and reliability, it enables compact, high-performance solutions for electric vehicles, industrial systems, and AI hardware. By combining robust power handling with scalability, this innovation strengthens next-generation designs in mobility and intelligent electronics.

Next-gen vehicle architectures drive innovation

A new initiative is accelerating the development of next-generation vehicle electrical and electronic (E/E) architectures. Focused on software-defined vehicles, it enables greater integration, scalability, and efficiency across automotive systems. By supporting advanced connectivity, electrification, and autonomous features, this approach reduces complexity while enhancing performance, paving the way for smarter, safer, and more sustainable mobility solutions.

High-voltage gate driver advances power management

A new gate driver technology is engineered for high-voltage power management applications, delivering improved efficiency, reliability, and safety. Designed to handle demanding environments, it supports wide-bandgap devices like SiC and GaN, enabling faster switching speeds and reduced energy losses. With robust protection features and optimized performance, this innovation strengthens power systems across automotive, industrial, and renewable energy sectors.

Next-gen chip design and verification breakthroughs

A new frontier in semiconductor design and verification is emerging, driven by advanced tools that accelerate innovation and ensure reliability. This approach integrates AI, automation, and cloud-based collaboration to streamline complex chip development. By enhancing productivity, reducing errors, and enabling faster time-to-market, these technologies are reshaping how engineers create and validate the next generation of high-performance integrated circuits.

AI-accelerated MCUs drive edge intelligence in vehicles

A new automotive microcontroller introduces built-in AI acceleration, enabling edge intelligence for next-generation vehicles.

Advanced 3nm TCAM powers automotive SoCs

A new 3nm ternary content-addressable memory (TCAM) technology is set to transform automotive system-on-chips.

Semiconductor breakthroughs reshaping everyday experiences

This article highlights three key advances: safer systems that enhance reliability in critical applications, smaller devices that pack more power into compact designs, and the integration of artificial intelligence that enables smarter, more adaptive solutions. Together, these breakthroughs are redefining industries from consumer electronics to robotics, making life more convenient, efficient, and secure