Bioiberica, Ryusendo Co., Ltd. to bring joint health benefits of Collavant® n2 to Japanese market
Collavant® n2 will become Bioiberica’s first branded nutraceutical ingredient to be launched in Japan.
2026-07-17 Bioiberica
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Bioiberica, Ryusendo Co., Ltd. to bring joint health benefits of Collavant® n2 to Japanese market
Collavant® n2 will become Bioiberica’s first branded nutraceutical ingredient to be launched in Japan.
2026-07-17 Bioiberica

GEA and CST partner to drive sugar industry transition
GEA and Chemical Systems Technologies (CST), an India-based engineering company specializing in process solutions for the sugar industry, have entered into a strategic partnership to accelerate the global adoption of decanter centrifuges in sugar mud dewatering.
2026-07-17 GEA

Why bringing GaN manufacturing in-house matters more than ever
As AI servers, EVs and energy-efficient power systems push power demands higher, GaN is becoming a strategic technology for semiconductor manufacturers. ROHM's move to internalize production reflects a broader industry trend toward securing advanced manufacturing capabilities and supply resilience.
2026-07-16 ROHM

Samsung commences mass production of PCIe 6.0-based eSSD
Samsung's latest eSSD features 9th-generation V-NAND, 4nm controller and liquid-cooling optimization to support demanding AI workloads.
2026-07-16

Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand
The company scales manufacturing of SiP-based Micro SSDs as demand grows for compact, high-performance storage in AI PCs and intelligent edge devices.
2026-07-16 Longsys

Applied Materials expands Singapore manufacturing to support AI chip demand
New state-of-the-art facility strengthens Applied’s global manufacturing and R&D capabilities to drive resilience and scalability
2026-07-16 Applied Materials, Inc.

Electronic system design industry revenue up 13% in 1Q 2026
The electronic design automation industry continued to report strong year-over-year revenue growth in 1Q 2026.
2026-07-16 ESD Alliance

AI Is fueling Lintes' next growth phase—and its biggest product push yet
Lintes Technology is accelerating its AI strategy with next-generation high-speed interconnect solutions and expanded automated manufacturing
2026-07-16 Lintes Technology

See More, Compute Less: ST's new 3D LiDAR targets the next wave of edge AI
STMicroelectronics has launched the VL53L9, its first direct Time-of-Flight 3D LiDAR module, bringing high-resolution depth sensing to compact edge AI systems.
2026-07-16 STMicroelectronics

AI boom drives memory fab spending past the $50 billion mark
The AI infrastructure boom is set to push global 300mm memory fab equipment investment past US$50 billion for the first time in 2026, according to SEMI.
2026-07-16 SEMI

Can hands-on ai labs speed up enterprise adoption?
Arrow Electronics has launched Global Experience Centers to help customers and channel partners turn AI ambitions into real-world deployments. Located in the US and Sweden, the facilities provide hands-on environments for testing AI, cloud and cybersecurity solutions, conducting proof-of-concept projects and validating multivendor architectures before investment—helping reduce risk and accelerate enterprise AI adoption.
2026-07-16 Arrow Electronics

SK keyfoundry advances auto chip reliability with new on-chip EMC protection technology
SK keyfoundry has developed a Bi-SCR-based on-chip EMC protection technology that improves the reliability of automotive semiconductors under harsh electrical conditions.
2026-07-16 SK keyfoundry
Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand
Applied Materials expands Singapore manufacturing to support AI chip demand
Electronic system design industry revenue up 13% in 1Q 2026
Can hands-on ai labs speed up enterprise adoption?
2026-07-16
IBM breaks the 1nm barrier with next-generation chip architecture
2026-07-16
Compounds for high-power, high-voltage power modules
2026-07-14
Adaptive drilling control for smarter deep-hole machining
2026-07-14
A compact clamp for high-precision machining in confined spaces
2026-07-14