AI‑powered CAM is here: Smarter machining, faster programming and robot automation

ENCY 3.0 takes CAD/CAM automation further with AI-assisted programming, advanced machining strategies, smarter robot motion and enhanced simulation. New tools help manufacturers streamline programming, optimize toolpaths, automate repetitive tasks and improve collaboration.

FARO CREAFORM brings handheld 3d scanner compatibility & casting Inspection to CAM2®

Enhanced alignment, color mapping, and cross-section analysis help manufacturers reduce scrap and accelerate decision-making

Tungaloy, NTK Cutting Tools to merge, building on complementary strengths

Tungaloy Corporation and NTK Cutting Tools announce that, effective January 1, 2027, NTK Cutting Tools will merge with Tungaloy, marking a new chapter for both organizations.

What makes plant-based food a real success?

White paper says taste and texture decide repeat purchase of plant-based foods

TGI Fridays™ expands into Pakistan

The plan includes 15 restaurants as TGI Fridays expands its footprint across South Asia and the Middle East under its 1-2-3 Strategic Vision.

Malaysia urges shift from halal-certified to halal-competitive

Malaysia calls for transition from halal-certified to halal-competitive as ASEAN targets USD5 trillion global halal economy

Complete optimization for lightweight PET bottles from a single source

Competek partners with PET packaging brands in achieving their lightweighting goals

Vitamin pairing slows progression of coronary calcification

Balchem’s K2VITAL™ DELTA was among ingredients used in a landmark clinical trial by DANCODE

Why shrink sleeves dominate the 2026 cosmetic refill trend

Function before format: The future of food innovation

Companies must adopt outcome‑driven innovation models that connect across categories and deliver measurable value, according to Karsten Smet, CEO at ACI Group

Dase-Sing showcases Industry 5.0 smart sleeve solutions with CGM at ProPak Asia

Dase-Sing showcased its capabilities and accomplishments at Asia's most important event for processing and packaging.

FOUP Injection Molding Machine: Complete Guide for Semiconductor Wafer Carrier Manufacturing

In the high-stakes high-precision semiconductor packaging landscape, the production of Front Opening Unified Pods (FOUPs) has evolved far beyond basic plastic fabrication.