Husky Technologies highlights sustainability, safety and affordability at Gulfood Manufacturing 2025
Husky Technologies returns to exhibit at Gulfood Manufacturing 2025 taking place in Dubai, UAE from November 4-6.
2025-11-05 Husky Technologies
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Husky Technologies highlights sustainability, safety and affordability at Gulfood Manufacturing 2025
Husky Technologies returns to exhibit at Gulfood Manufacturing 2025 taking place in Dubai, UAE from November 4-6.
2025-11-05 Husky Technologies

Building a food-secure future, together
Addressing food security is a shared mission among stakeholders and requires a holistic approach. ADM combines regenerative farming and responsible production practices, alongside nutrition innovation and local partnerships, to strengthen the entire food value chain.
2025-11-05 ADM

Formulating recipes with alternative proteins, natural sweeteners and colorants
Interview with Marc Duchene, CEO Asia Pacific, who leads Barentz’s regional growth and strategic expansion, and Christian Barker, Global CCO & Head of Human Nutrition Division
2025-11-05 FoodPacific Manufacturing Journal

Optifolin+® delivers superior folate bioavailability
New clinical study confirms Optifolin+® delivers superior folate bioavailability and rapid absorption compared to folic acid
2025-11-04 Balchem

Tachyum establishes Taiwan office to drive strategic growth in Asia
Tachyum has opened new offices in Taiwan in advance of production of the Prodigy Universal Processor.
2025-11-04 Tachyum

Universal Vapor Jet opens global headquarters, R&D center in Singapore
UVJC's facility includes its global HQ, its state-of-the-art R&D center, laboratory, and prototype manufacturing space.
2025-11-04 Universal Vapor Jet Corp.

Global silicon wafer shipments to rebound in 2025
Global shipments of silicon wafers are projected to increase by 5.4% in 2025, followed by steady growth through 2028.
2025-11-04 SEMI

ADI power studio unifies simulation, planning, and optimization
ADI's latest Power Studio offers advanced modeling, component recommendations and efficiency analysis with simulation.
2025-11-04 Analog Devices Inc.

Next-Gen 55nm BCD technology boosts performance and power efficiency across application
UMC's 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction.
2025-11-04 United Microelectronics Corp.

AI boom drives shift from HDD to ultra-high-capacity SSDs
HDD and SSD suppliers are expanding their high-capacity storage options amid the surge in AI inference applications.
2025-11-04 TrendForce

Bühler introduces CompactMix for chocolate and confectionery
The new solution offers precision, flexibility, and energy efficiency for delicious results
2025-11-04 Bühler

First AI PC platform built on 18A
Intel previews Intel® Core™ Ultra series 3 processors, (code-named Panther Lake) - the first client SoCs built on Intel 18A.
2025-11-04 Intel
Global silicon wafer shipments to rebound in 2025
ENGEL receives SPE honours for technological depth and solution expertise
Brenntag and Givaudan to deliver cosmetic actives and high-end specialties ingredients in Thailand
Cibus Tec Forum 2025: Parma at the center of European food innovation
2025-10-29
Global injection molding market to reach more than US$425 BN by 2032
2025-10-28
Indonesia's first UL-validated polypropylene resin from Polytama Propindo and Milliken
2025-10-28
2nd Ringier Formulation Master Awards in Personal Care: Winners announced
2025-10-28
Italy to lead international ISO working group on packaging machinery
2025-10-27