Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

AP Technology, a global custom memory solution design company, announced today that the S-SiCapTM (Stack Silicon Capacitor) product line continues to deepen its technology layout, focusing on the integration challenges of AI servers and high-performance computing (HPC). The S-SiCapTM product line covers two types: Discrete Devices and InterPoser with silicon Capacitor (IPC), which correspond to different system architectures and application scenarios to meet diverse design needs.

The capacitance density of the S-SiCapTM Gen4 discrete silicon capacitor has been increased to 3.8 μF/mm², an increase of more than 50% over the previous generation Gen3. In order to meet the demand for high performance and power in high-performance computing and AI servers, Gen4 has also taken the lead in introducing embedded substrate packaging, and samples have been sent for process verification, and the mass production introduction schedule will gradually begin from 2026.

On the other hand, the silicon capacitor interposer S-SiCapTM Interposer uses a silicon wafer as the interposer substrate and has a built-in silicon capacitor with high capacitance density, which significantly enhances the signal and power stability of die-to-die, sequencer/desequencer (SerDes), and high-bandwidth memory (HBM) high-speed I/O applications. AP also collaborates with the supply chain to introduce reticle-stitching technology to expand the die area of the interposer, thereby carrying more chiplet ICs to meet the needs of advanced packaging for higher integration. At present, the S-SiCap^TM Interposer has completed the packaging and reliability verification of the client, and officially entered the mass production stage of four reticles at the end of the third quarter, and new projects are also starting one after another.

Hong Zhixun, general manager of AP Technology, said that with the rapid growth of AI and high-performance computing applications, the market has increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCapTM product line, AP integrates silicon capacitors into various advanced packaging architectures in the form of discrete and interposers, combining high performance, high integration, and design flexibility to meet the stringent needs of next-generation AI and HPC systems. Looking ahead, AP is also actively developing silicon capacitor products that can be used in organic interposers and continues to expand its product territory.