ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore

Singapore is strengthening its position as a regional semiconductor innovation hub through a new partnership focused on accelerating AI-driven materials discovery and next-generation semiconductor research. ATLANT 3D and the National University of Singapore (NUS) have announced a collaboration to establish an advanced materials discovery foundry in Singapore, aimed at transforming how semiconductor materials are developed and validated.

The initiative combines ATLANT 3D’s atomic-scale manufacturing technology with NUS’s research capabilities in materials science, electronics, and artificial intelligence. The collaboration is expected to support rapid experimentation and development of advanced materials for semiconductors, photonics, quantum technologies, MEMS, sensors, and other emerging electronic applications. 

At the center of the partnership is ATLANT 3D’s direct atomic layer processing (DALP) technology, which enables precise deposition of materials at the atomic scale. Unlike traditional semiconductor manufacturing methods that often require complex multi-step processes, DALP allows localized material growth with high precision, enabling faster prototyping and more flexible materials engineering. 

The integration of AI into materials discovery is becoming increasingly important as semiconductor technologies approach physical scaling limits. Traditional materials development can take years due to extensive testing and process optimization. AI-driven platforms are now being used to accelerate simulation, process tuning, and experimental validation, significantly reducing research timelines for new semiconductor materials and device architectures. 

The Singapore-based foundry is expected to support rapid experimentation workflows where AI models can help identify promising material combinations and optimize deposition parameters in real time. This approach could accelerate development cycles for advanced chips, quantum devices, photonic systems, and energy-efficient electronics. 

The partnership also aligns with Singapore’s broader strategy to strengthen its semiconductor ecosystem and advanced manufacturing capabilities. Singapore has been expanding investments in semiconductor R&D, AI infrastructure, and deep-tech innovation as part of efforts to remain competitive within the rapidly evolving global electronics industry. 

As AI, quantum computing, and advanced electronics applications continue increasing in complexity, demand is growing for new materials capable of delivering higher performance, lower power consumption, and improved scalability. Semiconductor companies and research institutions worldwide are increasingly investing in AI-assisted materials engineering to accelerate next-generation technology development.

The ATLANT 3D–NUS collaboration highlights the growing convergence of AI, advanced manufacturing, and semiconductor research. By combining atomic-scale fabrication with AI-driven experimentation, the initiative aims to create a faster and more flexible pathway for discovering and commercializing future semiconductor materials and device technologies.