Compounds for high-power, high-voltage power modules

SABIC announced a new series of LNP™ THERMOCOMP™ compounds well suited for high-power, high-voltage electric drive and power module applications, such as insulated gate bipolar transistor (IGBT) power switching devices. New LNP THERMOCOMP OFM76XXP and OFM76EXP compounds, based on polyphenylene sulfide (PPS) resin, deliver excellent impact strength and dimensional stability, a robust comparative tracking index (CTI-PLC 0) and resistance to thermal shock to address increasingly stringent requirements. They also feature high heat resistance, dielectric strength for effective electrical insulation and UL94 V0 flame retardancy (FR).

These high-performance materials have the potential to be used in power modules for high-voltage (i.e., 800V and above) electric vehicle traction inverters and fast chargers, as well as renewable energy systems and industrial automation applications such as robotics.

“Higher voltages, greater power densities and miniaturization are driving manufacturers of critical power electronic devices like IGBT switches to choose materials that help enhance stability and power,” said Sergi Monros, vice president, Specialties Business. “Our experts stay ahead of changing customer requirements through proactive development of specialty thermoplastics that surpass existing solutions. We continue to enhance our renowned portfolio of LNP compounds with new capabilities, higher performance and extended reliability.”

As with other PPS resins with a CTI rating of PLC 0, the new LNP THERMOCOMP compounds with the highest CTI level, combine excellent strength and insulation performance under thermal aging, but with enhanced toughness. The SABIC compounds achieve 90 percent retention of strength and insulation capability after 1000 hours of heat aging at 200°C. Compared to polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, they provide superior dimensional stability and resistance to thermal shock. These new grades support miniaturized, lightweight designs with thin-wall FR capability (UL94 V0 at 0.4mm). Furthermore, they can be produced in white or light colors for visibility of compulsory QR codes printed on IGBTs.

The next-generation LNP THERMOCOMP OFM76EXP grade offers enhanced laser marking capability, the highest impact strength of comparable materials, adhesion to silicone-based sealants and crack resistance.

In addition to IGBT module insulation base plates, these materials have the potential to be used in DC power transmission systems, high-voltage inverters and breakers, integrated busbar brackets and renewable energy infrastructure.

LNP THERMOCOMP OFM76XXP and OFM76EXP compounds are available globally.