AI Is fueling Lintes' next growth phase—and its biggest product push yet

Source：Lintes Technology Release Date：2026-07-16 45

Semiconductor / Electronic ChipIntelligent AutomationArtificial Intelligence & Machine Learning Artificial Intelligence & Machine Learning

Lintes Technology is accelerating its AI strategy with next-generation high-speed interconnect solutions and expanded automated manufacturing

AI infrastructure is creating new opportunities across the connectivity ecosystem, and Taiwan's Lintes Technology is moving quickly to capture them. After posting a 17.2% year-on-year increase in first-quarter revenue, the high-speed interconnect specialist is expanding both its product portfolio and manufacturing capabilities to meet growing demand from AI servers and hyperscale data centers.

At COMPUTEX 2026, Lintes is showcasing a broad range of connectivity technologies that support every layer of AI infrastructure—from edge devices to large-scale AI clusters. The lineup includes active and direct attach cables (AEC and DAC), next-generation Co-Packaged Copper (CPC) and Co-Packaged Optics (CPO) solutions, as well as MCIO, Multi-Trak, SlimSAS, Thunderbolt and USB interconnects for high-bandwidth computing environments.

Lintes CPC and CPO Solution-1200x630.jpg

The company has also accelerated investment in next-generation R&D, focusing on technologies expected to support future AI server architectures. Among its latest developments are 6.4T CPC and 32TX+32RX CPO sockets, designed to address the industry's growing need for higher bandwidth, greater signal integrity and improved power efficiency.

Supporting these innovations is a parallel investment in manufacturing. Lintes has been upgrading its production facilities with flexible, automated manufacturing lines capable of scaling with global demand. The strategy is reinforced through its partnership with Gen Precision, whose expertise in ultra-precision machining and factory automation enables manufacturing tolerances down to 0.1 μm for passive optical components.

By combining advanced product development with highly replicable automated production, Lintes aims to strengthen its position in the fast-growing AI infrastructure market. As hyperscale data centers continue to expand worldwide, the company is positioning itself as a key supplier of the high-speed connectivity technologies needed to power next-generation AI systems.