Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand

Chinese memory and storage manufacturer Longsys has reached a new manufacturing milestone after establishing a stable production capacity of one million Micro SSD (mSSD) units per month, expanding its ability to supply compact, high-performance storage solutions for next-generation edge AI devices.

The achievement marks the successful transition of the company’s mSSD platform from pilot production to high-volume manufacturing as demand increases for integrated storage in AI-enabled computing systems.

Scaling Production for Edge AI Devices

Longsys produced its first mSSD engineering samples at its Suzhou packaging and testing facility in October 2025.

Following several months of production-line optimization, manufacturing refinement and process validation, the company announced that stable monthly output reached one million units in June 2026.

The manufacturing ramp enables Longsys to support growing customer demand while providing additional capacity for future expansion.

According to the company, the storage modules have already been validated in commercial applications and are being developed with major hardware manufacturers, including Lenovo and ASUS.

System-in-Package Redefines SSD Design

Unlike conventional solid-state drives built around printed circuit boards, Longsys’ mSSD platform adopts a System-in-Package (SiP) architecture that integrates multiple storage components into a single compact package.

The design combines the SSD controller, NAND flash memory, power management integrated circuit and passive electronic components into one highly integrated module.

This packaging approach reduces physical size, simplifies assembly, shortens manufacturing cycles and improves overall reliability while maintaining high storage performance.

The compact architecture is particularly suited to AI PCs, intelligent terminals and other edge computing devices where available internal space is increasingly limited.

Supporting PCIe Gen4, Gen5 and Beyond

Longsys currently offers mSSD solutions supporting both PCIe Gen4 and PCIe Gen5 interfaces.

The latest Gen5 products incorporate customized thermal management systems, including vapor chamber cooling technology, allowing the compact drives to sustain higher bandwidth and larger storage capacities under continuous AI workloads.

The company also said its SiP architecture is designed to support future PCIe Gen6 storage standards while meeting consumer, industrial and automotive reliability requirements.

Integrated Hardware and Software Platform

Beyond storage hardware, Longsys has expanded its edge AI strategy by developing an integrated intelligent storage platform.

Earlier this year, the company introduced its proprietary SPU (Storage Processing Unit) alongside iSA (Intelligent Storage Agent) and HLCache technologies, combining storage hardware with software optimization to improve data processing efficiency for AI applications.

The integrated architecture is intended to reduce latency while enabling smarter management of data-intensive workloads at the network edge.

Positioning for the AI Computing Era

As artificial intelligence workloads continue moving from centralized cloud infrastructure toward local devices, demand is increasing for storage solutions capable of delivering high bandwidth, low latency and compact form factors.

By combining large-scale SiP manufacturing with advanced packaging, thermal engineering and intelligent storage technologies, Longsys aims to strengthen its position in the rapidly expanding edge AI ecosystem.

The company said future development will focus on broadening deployment of its mSSD platform across AI PCs, AI boxes and other intelligent edge devices while continuing to advance next-generation PCIe storage technologies for commercial applications.