As chips become more delicate, wafer handling takes centre stage

Based on an interview with Stefan Detterbeck, Sales Director, mechatronic systemtechnik GmbH, during SEMICON Southeast Asia 2026.

The semiconductor industry's next phase of growth isn't just about producing more chips—it's about handling them more carefully.

As advanced packaging technologies, silicon carbide (SiC) power semiconductors and compound semiconductor materials gain momentum, manufacturers are facing a new challenge: moving increasingly fragile wafers through production without compromising yield.

For many years, wafer handling was considered a supporting process. Today, it has become a critical part of semiconductor manufacturing, particularly as thinner wafers, warped substrates and larger wafer formats become more common.

Speaking with International Metalworking News for Asia during SEMICON Southeast Asia 2026, Stefan Detterbeck, Sales Director at mechatronic systemtechnik GmbH, said these manufacturing trends are driving growing demand for specialised automation across Asia.

"We are seeing strong demand driven by advanced packaging," Detterbeck said. "At the same time, power semiconductors represent another major growth opportunity, particularly with the increasing adoption of compound semiconductors for electric vehicles and AI applications."

A new generation of substrates

Unlike conventional silicon wafers, many of today's semiconductor substrates present significantly greater handling challenges.

Advanced packaging often involves thin or stacked wafers, while power semiconductor production increasingly relies on silicon carbide and other compound semiconductor materials. These substrates require careful handling throughout production because even small amounts of mechanical stress can affect manufacturing quality and yield.

According to Detterbeck, manufacturers are therefore placing greater emphasis on automated wafer handling systems capable of moving sensitive, non-standard substrates safely and consistently.

"Handling SiC substrates after grinding, or transitioning to larger wafer sizes, requires extremely low mechanical stress," he explained. "Flexibility is becoming just as important as precision."

Rather than relying on conventional automation, semiconductor manufacturers are increasingly looking for handling systems that can accommodate a wider variety of substrate types without requiring extensive modifications to existing production lines.

Scaling production without disrupting operations

The industry's rapid expansion is also creating pressure beyond technology itself.

As investment in semiconductor manufacturing accelerates, equipment suppliers are expected to deliver systems quickly while supporting customers throughout installation and production ramp-up.

"One of the central challenges facing the industry right now is keeping pace with increasing demand," Detterbeck said. "We work closely with customers to support lead times and provide the local assistance they need to succeed."

To meet these changing requirements, modular equipment designs are becoming increasingly attractive. Instead of replacing complete production systems as manufacturing evolves, customers can upgrade or expand existing platforms, reducing both investment costs and production disruption.

This flexibility is particularly valuable as semiconductor manufacturers continue adapting to rapidly changing technology roadmaps.

Asia continues to drive investment

The growth of advanced packaging and power semiconductor manufacturing is also reshaping regional investment patterns.

Detterbeck identified Malaysia as one of the strongest markets for power semiconductor applications, supported by increasing demand from electric vehicles and AI-related industries. For advanced packaging, he pointed to China, Taiwan and South Korea as major centres of activity, reflecting continued investment in next-generation semiconductor manufacturing.

These developments have prompted mechatronic systemtechnik to strengthen its regional presence in recent years through expanded engineering resources and the establishment of mechatronic Taiwan, alongside continued investment in sales and technical support across Asia. Today, the company maintains local operations in key semiconductor markets including Taiwan, China, Malaysia, Singapore and South Korea, enabling closer collaboration with customers as manufacturing requirements become increasingly sophisticated.

Specialising in difficult wafer handling

Founded in 1998 and headquartered in Fürnitz, Austria, mechatronic systemtechnik has built its reputation by focusing on one of semiconductor manufacturing's most specialised areas: the fully automated handling of non-standard substrates.

Its systems are designed to process challenging wafer formats—including thin, warped and stacked wafers, as well as eWLP, MEMS, TAIKO, bumped wafers and film frames—that conventional handling equipment often struggles to manage. Through a modular engineering approach, the company develops automation systems capable of accommodating a wide variety of substrate types while maintaining the flexibility required by semiconductor manufacturers worldwide. Today, mechatronic systemtechnik operates as part of the Accuron Group, serving major OEMs and fabrication plants across Europe, Asia and the United States.

Precision handling becomes a competitive advantage

As semiconductor manufacturing continues moving toward advanced packaging, AI processors and compound semiconductors, wafer handling is becoming far more than a material transport process.

Every transfer between production stages represents an opportunity either to protect yield or introduce defects. For manufacturers investing billions in next-generation semiconductor capacity, automation that reduces mechanical stress, increases flexibility and supports changing production requirements is becoming an increasingly important part of maintaining competitiveness.

The shift highlights a broader trend across the semiconductor industry: as chips become more advanced, the technologies surrounding their manufacture—from inspection and metrology to wafer handling—are becoming just as critical to production success. Companies such as mechatronic systemtechnik are responding by developing specialised automation that helps manufacturers handle tomorrow's devices with the precision today's semiconductor industry demands.