Smart handling for smarter semiconductor manufacturing

Based on an interview with Adrian Soh, Vice President, esmo Asia, and Francis Wee, Regional Sales Manager, esmo Asia, during SEMICON Southeast Asia 2026.

The semiconductor industry is entering a new phase of manufacturing. Artificial intelligence (AI), advanced packaging and increasingly sophisticated chip designs are pushing manufacturers to rethink not only how semiconductors are produced, but also how production floors operate.

Much of the attention has focused on cutting-edge technologies such as AI-powered inspection systems, digital twins and autonomous manufacturing. Yet, some of the biggest productivity gains can come from solving everyday operational challenges that quietly consume time, labour and equipment capacity.

For esmo Asia, smarter manufacturing starts with improving the way semiconductor test floor’s function.

Speaking with International Metalworking News for Asia during SEMICON South East Asia 2026, Adrian Soh, Vice President of esmo Asia, said the region's semiconductor industry is evolving rapidly as manufacturers move toward more advanced applications.

"The semiconductor industry in South East Asia is at an important inflection point," Soh said. "What is particularly evident is the industry's focus on AI-driven applications and advanced packaging technologies."

As chip architectures become more complex, the operational demands placed on semiconductor manufacturers continue to increase. Test boards are becoming larger and heavier, product changeovers are more frequent, and manufacturers face constant pressure to maximise automated test equipment (ATE) utilisation without compromising productivity. These changing requirements are driving greater interest in automation that improves precision, repeatability and operational efficiency.

Looking beyond traditional automation

When discussing smart factories, automation is often associated with robots or fully automated production lines. However, Soh believes manufacturers should also examine the smaller processes that affect production efficiency every day.

"In response to these industry shifts, we're investing in smarter handling solutions that improve precision, streamline changeovers, reduce operator dependency and enhance overall test floor efficiency," he explained.

One of those challenges is the physical handling of semiconductor load boards.

According to Francis Wee, Regional Sales Manager at esmo Asia, as semiconductor devices become more advanced, the equipment used to test them also becomes larger, heavier and more expensive. While board changeovers may seem routine, they can introduce safety risks, positioning errors and unnecessary machine downtime when performed manually.

"Customers are being asked to do more with less margin for error and less tolerance for downtime," Wee said. "Manual handling creates real risks that can quietly reduce ATE utilisation."

To address this challenge, esmo unveiled its X-change Cart during SEMICON South East Asia 2026. Designed specifically for semiconductor test floors, the system enables a single operator to complete a load board changeover in under one minute while improving consistency and workplace safety. By standardising what has traditionally been a manual process, manufacturers can reduce operator fatigue, minimise handling errors and increase equipment availability.

Engineering for production realities

The X-change Cart reflects a broader engineering philosophy that has guided the company since its establishment in 2001.

Headquartered in Rosenheim, Germany, esmo group has grown into an international engineering company serving multiple industrial sectors through two complementary business divisions. While esmo automation provides machinery engineering and industrial automation solutions, esmo semicon specialises in manipulators, docking and interfacing components, and advanced handling systems for semiconductor manufacturing worldwide. Today, the company operates as a subsidiary of Accuron Industrial Technologies, combining German engineering expertise with regional support capabilities across Asia.

Rather than developing standard products for every customer, esmo focuses on customised engineering solutions designed around real manufacturing environments.

Soh explained that manufacturers today require equipment that can evolve alongside changing technologies rather than being replaced every few years. As semiconductor roadmaps continue to change, flexibility has become just as important as precision.

"Rather than competing directly in the most crowded product categories, we engineer solutions for the operational challenges that fall between what the major OEMs address," he said. "Our modular and upgradeable solutions allow customers to adapt without wholesale equipment replacement."

The company's broad compatibility across leading ATE platforms also provides manufacturers with greater flexibility, allowing production lines to evolve without becoming tied to a single equipment ecosystem.

South East Asia remains a strategic growth market

As global semiconductor manufacturers continue diversifying their supply chains, South East Asia is emerging as one of the industry's most important growth regions.

According to Wee, Malaysia continues to offer strong opportunities as investments expand beyond traditional assembly and test into advanced packaging, IC design and research and development. At the same time, Singapore remains strategically important through its concentration of engineering expertise, semiconductor equipment companies and R&D activities. The wider ASEAN region is also benefiting from ongoing supply chain diversification under China+1 strategies, creating new demand for semiconductor manufacturing equipment and automation solutions.

For esmo, these developments reinforce the importance of maintaining a strong local presence.

Soh said the company intends to deepen its technical support capabilities across South East Asia over the next two years, particularly in Malaysia and Singapore, while strengthening relationships with manufacturers throughout the region.

"As these markets move further up the semiconductor value chain, customer requirements become more sophisticated," Soh said. "We want to be positioned as a long-term engineering partner throughout that transition."

Rather than simply supplying equipment, the company aims to support customers throughout the lifecycle of their production systems through local application engineering, technical support and collaborative problem-solving.

Building smarter factories, one process at a time

Smart factories are often associated with major digital transformation projects, but the reality is that manufacturing performance is frequently determined by the accumulation of smaller improvements across hundreds of daily operations.

For semiconductor manufacturers, something as routine as changing a load board can influence equipment utilisation, operator safety and overall production efficiency. As AI, advanced packaging and heterogeneous integration continue to reshape semiconductor manufacturing, these seemingly minor processes are becoming increasingly important.

For esmo, smart manufacturing is therefore not simply about introducing more automation—it is about applying engineering expertise to eliminate inefficiencies wherever they exist. Whether through smarter handling systems, modular automation platforms or closer technical collaboration with customers, the company's approach reflects a broader shift taking place across South East Asia's semiconductor industry: building factories that are not only more automated, but also more agile, productive and ready for the next generation of semiconductor manufacturing.