MICROIP wins US$20M smart residential edge AI project in Taiwan

Source：MICROIP Release Date：2026-09-14 38

Semiconductor / Electronic ChipSemiconductor Process EquipmentSemiconductor Packaging EquipmentSemiconductor Testing EquipmentSemiconductor Process Materials/Gases/ChemicalsIndustrial Control Systems/Auxiliary SystemsIntelligent AutomationArtificial Intelligence & Machine Learning

Three-year system integration project marks MICROIP's expansion from ASIC design into vertical Edge AI deployments.

MICROIP has secured a system integration contract valued at approximately US$20 million for an AI-enabled smart residential community development in Taiwan, marking a further expansion of its business from custom ASIC design into large-scale Edge AI system integration.

The 36-month project will begin with system architecture planning and project management in October 2026. MICROIP will act as the core project manager and overall architecture integrator, overseeing the deployment of its Edge AI technologies within the community’s operational infrastructure.

The system is designed around decentralized, on-device computing to support real-time processing while reducing cloud transmission requirements, network latency and bandwidth consumption. Keeping data on-site is also intended to address privacy requirements for residential applications.

According to MICROIP, the deployment will support AI-based vision recognition, dynamic energy scheduling and scalable AIoT networking across the community. The architecture combines software and hardware integration with AI platform interfacing, followed by subsystem validation.

MICROIP said revenue from the project will be recognized progressively over its duration using the percentage-of-completion method under IFRS 15, with contributions tied to completed and accepted project milestones.

The customer has not been identified because of confidentiality agreements.

The contract provides a significant commercial deployment for MICROIP’s Edge AI strategy as the company looks to extend its software-hardware integration capabilities beyond semiconductor design. The company said it will continue developing heterogeneous edge computing architectures and custom algorithms for applications including smart buildings, intelligent security and smart manufacturing.