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Moldex3D 2021 for enhanced simulation capabilities

Source:Moldex3D     Date:2021-04-28
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CoreTech System Co., Ltd. (Moldex3D) announced the release of Moldex3D 2021 – the latest version of its moulding analysis software series. This new generation of Moldex3D continues to refine simulation capabilities to provide better user experiences. More powerful analysis modules are also incorporated in the system to meet different customer needs across industries. In response to a faster changing market in the Industry 4.0 era, Moldex3D 2021 helps businesses realise seamless design and manufacturing integration, producing world-class products within stricter time limits.


The important updates and highlights of Moldex3D 2021 include more accurate and customised simulation reports. For common shrinkage and warpage prediction of injection moulding, Moldex3D 2021 combines the material and stress characteristics of plastic phase changes in the packing stage, highly increasing the prediction accuracy. Furthermore, mechanical property simulation is introduced to optimise the calculation accuracy of short fibre materials, enabling users to receive better results of warpage prediction of fibre-filled materials. The curve construction and editing capabilities are also enhanced to generate higher-quality mesh with greater success rate and efficiency. With the newly added Nozzle Zone Wizard as well as the upgraded Gate, Runner and Cooling Channels Wizards, users are able to optimise designs with parameters and automatic mesh generation, making design validations easy and precise.


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Another highlight in the new Moldex3D 2021 is that different analysis reports can be required based on mould characteristics. Users can use Studio 2021 to customise their report format and choose which items to display.


The seamless integration of virtual and reality and quick access of all data is another highlight of Moldex3D 2021. Nowadays, enterprises emphasize more on data cloudisation and digitalisation. However, how to integrate virtual and real data is a challenging task. With Moldex3D iSLM, users can manage, share, and compare mould trial results and moulding analysis through a simple click using their laptops or smart phones. Information can be accessed anytime, anywhere.


Moldex3D 2021 has also optimised the efficiency of submission process and parallel processing on Linux HPC (High Performance Computing). Engineers can run moulding simulation efficiently on the remote Linux HPC cluster, on private or on public cloud, making it possible to analyse and calculate millions of elements in minutes.


Enhanced accuracy in advanced process and composite materials can also be achieved. The market always pursues progress and advanced process simulation needs to be more precise. Moldex3D never stops constructing high-end advanced process prediction capabilities, assisting companies to be more competitive in product development and optimisation. Moldex3D’s non-matching mesh technology reduces the mesh generation time and improve the accuracy for RTM (Resin Transfer Moulding) simulation of multi-layer fibre mat draping design. The new physical foaming capabilities provide a new microscopic foaming prediction model, which greatly increases the prediction precision of the existing modules of different foaming processes.


In addition to the above breakthroughs, Moldex3D 2021 also supports Fibre-mat thermoplastic continuous fibreboard composite simulation. By setting the continuous fibre material property values, users can analyse how fibre orientation impacts product quality and mechanical strength to further optimise their product designs.

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Due to the trend of intellectualisation and electric vehicles, global industries have rising demand on reliable IC product performance. Advanced IC packaging technology plays an increasingly critical role in manufacturing process. Moldex3D’s new potting simulation capabilities are now available for IC packaging users with complete support. The Pre-processing Wizard can quickly generate high-quality mesh, which saves model preparation time and helps users validate IC packaging design, reducing trial and error costs significantly.

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For more information about the new features of Moldex3D 2021, please visit:



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