HARTING (Zhuhai): The trend in the industry is for devices to be getting smaller

At IAS 2015, HARTING presents the new connector groups of har-flex® and har-flexicon® for board-to-board and cable-to-board solutions. By offering new and innovative system components, HARTING hope to help customers keep pace with increasing complexity and ongoing miniaturisation of PCBs. Small “box architectures” are expected to replace or supplement some of the large, heavy backplane systems. This has led to increased demand in the market for new types of cost effective, flexible and high density interconnect systems.

He added, In future automation technologies, the computing power will be more redistributed in the field. At the same time, the sheer number and density of sensors will increase significantly. With the miniaturized innovative components provided by HARTING, this decentralized computing power and the mass of data and signals can be implemented and networked to modular.

To meet the requirement of being small, robust, modular and quick and easy to use, HARTING offers its customers today all the necessary components for connecting these rapidly progressing development. To keep the system as small and space-efficient as possible, the connector families har-flex® / har-flexicon® were used in the casing. To ensure a fast and expandable cabling, and going toward miniaturization, the new M12 Power and preLink® system are the products of choice. With its almost unique portfolio, HARTING offers proper solutions for industry 4.0 and the “heart” of industrial automation.

HARTING has been participating IAS for over ten years. It provides a platform for companies to publish latest technologies and market ready solutions and create opportunities for players in the value chain.

HARTING (Zhuhai) Sales Ltd
Booth No: 5.1H- B001
Tel：+86-756-362 7590
E-mail：kilian.shmale@HARTING.com
Website：www.HARTING.com.cn
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