K&S expands copper wire bonding solutions

SINGAPORE – Kulicke and Soffa Industries, Inc. (K&S) has expanded its Advanced Copper Solution (ACS) Series Capillaries, with the addition of ACS MaxTM and ACS LiteTM for copper wire bonding applications. Both capillaries will debut at the SEMICON China show at the Shanghai New International Expo Centre, Booth #3417, from March 18-20, 2014.

Nelson Wong, vice president, Wire Bond Solutions Business Unit, remarked, "Aligned with our leading position in copper wire bonding, the introduction of ACS Max and ACS Lite further enhances our customer’s ability to create high quality bonds using larger diameter copper wire. The unique design dynamics of the ACS Series drive cost of ownership benefits by enabling a wider process window and more consistent bond quality throughout the capillary’s life.”

The ACS Series of capillaries are based on advanced material development and deep-rooted application knowledge at K&S. This family of capillaries offers production benefits for various copper wire bonding applications and has been expanded to serve the broader copper market:

> ACS Max for advanced package carrier families, such as mid-pin count QFP, QFN, PPF, uPPF and leadframes with a bond pad pitch range of 70-120 microns;

> ACS Lite for low-pin count applications, such as discrete & powered integrated circuit applications using large wire diameters and a bond pad pitch in excess of 120 microns.

In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices.NIKE AIR MAX