Laser device cleans wafer baking plates

WAFER producers know are all too familiar with this problem: Sticky residues that need to be scraped from the baking plates in order for the plates and the wafers to separate cleanly. Previously these baking plates were cleaned with either dry ice, brushes or chemicals – and a lot of muscle. Now a Laser Cleaning Unit from Franz Haas Wafer removes fat, sugar and batter residues from the baking plates without direct contact – even gentler than dry ice, more reliably than a brush, and environmentally friendlier than chemicals.

“RV-SWAK”, the completely new, gentle and precise cleaning module for contaminated baking plates, can be used on all ovens of the series SWAKN and SWAKT models. The unit is suitable for all baking plates and plate dimensions, all flat, and almost all hollow wafer engravings.

Advantages at a glance:
• No mechanical stress
• Gentle and precise cleaning
• No damage to chromium plating
• No residues due to suction system
• Environmentally friendly
• No cleaners, no chemicals, no solvents

Highly flexible and applicable to all new machines using a standardized interface, the laser cleaning device is easy to operate using a plug-and-play concept. It comes with fast set-up, is fully automated and is connected to the oven PLC. Furthermore, it can be retrofit to previous models.

One cleaning shift takes 8 hours for an 88 baking plate oven with a 350mm x 500mm plate format. It is coupled to one oven and after finishing a shift, the cleaning unit can be transferred to the next oven thus saving time and money. The cleaning process does not need any assistance or any additional cleansing material and does not affect the warranty of the baking plates.