PACK EXPO buyers looking to update their secondary packaging will find a new lineup from Bosch Packaging Technology. The company is excited to launch the Sigpack TTMC and the Elematic 3001 case packers, as well as the CCM case packer for both vertical and horizontal bag presentation.
“Our secondary packaging equipment is built for ease-of-use and reduced total cost of ownership (TCO), and can be run 24 hours a day, seven days a week,” said Paul Garms, marketing manager, Bosch Packaging Technology Inc., New Richmond. “Combined with our primary packaging technologies, this portfolio of technologies addresses manufacturers’ need for a single-source solutions provider.”
The Sigpack TTMC has lightweight format parts and easily accessible doors, which are interlocked to prevent operators from accidentally opening them for increased workplace safety
The Elematic 3001 case packer runs multiple pack styles including tray, classic full wrap-around, ledge tray as well as two-part shelf-ready packaging
The Elematic 3001 wrap-around case packer emphasizes safety and ease of use. A low blank magazine height simplifies operation and minimises the risk of injury. The hot melt system has been optimised with an external granulate container, which helps protect operators when refilling glue. Like the Sigpack, tools are not required for changeovers. When parts lock into place, operators are notified with a click sound and aligned color-coded components, letting them hear and see that the format changeover is complete. 
To help manufacturers meet changing retailer demands, the CCM 3100 case packer features a wide format range in both bag and case sizes and styles, including RSC, HSC and other shelf-ready packaging styles
The CCM 3100 flexible case packaging is ideal for shorter production runs and more frequent changes in product packaging styles. It has a wide format range in both bag and case sizes and styles, including the RSC, HSC and other shelf-ready packaging styles. This case packer also integrates easily with vertical form, fill and seal (VFFS), as well as horizontal form, fill and seal (HFFS) machines.
At PACK EXPO 2014, which takes place in Chicago from 2 to 5 November, visit Bosch at South Hall, booth S-3514 and at the West Hall, booth W-603. PACK EXPO International.
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