Polymer technologies for E&E sector at CHINAPLAS 2016

The Electrical and electronics (E&E) sector requires highly specialized materials and processing technologies since E&E products are getting smaller and  more interconnected. Thus, designers continue to bring additional electronic features into the slim, compact form factors of these packages. This often turns out products that can withstand extremely high temperatures and with  thin walls, and Class A, multi-material finishes, all while incorporating such qualities as durability and  highly sensitive touch screens.

Ar CHINAPLAS 2016, exhibitors of the latest materials and technologies for E&E application are expected to present their offerings. Currently Asia's No. 1 and the world's No. 2 and plastics and rubber show, CHINAPLAS 2016 will be held from 25-28 April, 2016, at the Shanghai New International Expo Centre in Pudong, PR China with more than 3,200 companies from over 40 countries and regions.

Many exhibitors with  direct application in the E&E industry will be present. Exhibitors who have already made their booth reservations include Demag, BASF, Clariant, Covestro, DSM, Du Pont, Emschemie, Engel, ExxonMobil, Hasco, Hotsys, Inglass, Husky, Jushi Group, KEP, Lanxess, LG CHEM, Mitsubishi, Mitsui Chemicals, Mold Masters, Mould-Tip, Nordson, Polyplastics, SK Global, Solvay, Synventive, Yizumi, Yudo, Zhejiang Shuanglin, and more.

It is expected that some 140,000 professional buyers from 150 countries and regions will visit the show. The exhibition in 2015 has attracted a number of leading E&E companies to attend, such as 3M, Apple, Changhong Electric, Dyson, Electrolux, Flextronics, Foxconn, Fuji Xerox, Gree Electric Appliance, Haier, Huawei, Jabil Electric, LG, Midea, Mitsubishi, Panasonic, Philips, Samsung, Techtronic, Vtech and ZTE, to name just a few.

Target: the E&E sector
For E&E production, Bayblend FR4000 flame-retardant polycarbonate blends from Covestro (the former Bayer MaterialScience) will be on exhibit. Ideal for high-heat electronic housings, these products are lightweight, resistant to fire and weathering, and can withstand high mechanical loads. The firm claims they also incorporate environmentally friendly technology and are well suited for use in thin-walled components.

DSM NV offers high-performance polyamides such as Stanyl 46 and Stanyl ForTii that are tailored for E&E applications, including connectors, switchgears, surface mount technology and LED lighting. Stanyl 46, for example, retains its mechanical properties at temperatures of up to 230°C.

Solvay Specialty Polymers will showcase how it applies its Solvene EAP electro active polymers with Plastic Logic's organic thin-film transistor technology to create flexible, low-power electronics. The aim is to give product designers the freedom to make more stylish and ergonomically friendly mobile devices, wearables and the like.

Dow Corning TC-3040 Thermally Conductive Gel (TIM 1) is the thermal interface material used to apply between a chip's surface and a heat spreader to provide more effective and reliable thermal management for semiconductors. The gel delivers twice the thermal performance of other industry standard TIMs.

The e-motion 30 TL injection molding machine from Engel Group, for example, is designed specifically for molding small precision parts. Among the offerings from Canada's Husky Injection Molding Systems is its Husky VX valve-gate hot-runner system for the very high-performance PEEK (polyetheretherketone) engineering resins that are needed in some E&E applications. And automation specialists such as Shini Plastics Technologies and Wittmann Battenfeld offer robots with blazing speed and amazing precision for use in sophisticated production cells.

These are only but a few examples of the variety of  materials and equipment that are intended for the highly  dynamic E&E products sector.