Reliable positioning prevents expensive crashes

Renishaw’s RESOLUTE? encoder is an innovative, true-absolute measuring system that guarantees maximum process reliability for precision assembly systems used in the micro-electronics and micro-optics industries.

Process reliability is one of the principal factors governing the economic operation of high-value micro assembly machines that produce miniature electronic and optical components. Amicra Mikrotechnologie GmbH has achieved major improvements with Renishaw’s future-oriented absolute measuring system, RESOLUTE, which allow Micro Assembly Cells to be commissioned more quickly and, in particular, independently of the operator’s vigilance. This is particularly important for micro-electronics and micro-optics applications in the automotive sector, telecommunications and IT industries.

Fast feed and very precise positioning

The components to be bonded and mounted, such as active / passive semi-conductors, lenses, MEMS, and processors, are picked up with the aid of linear axes and special grippers from feed stations. The components are then positioned on boards or wafers, where they are bonded with adhesives, soldered conventionally or soldered with a laser beam. Surface mounting on wafers and stack die technology make particular demands on mounting and production technology. Stack die technology is used to construct three-dimensional memory and computer structures; Semi-conductors are not only mounted horizontally next to each other and connected (SoC), but also vertically in several planes (TSV). Further miniaturisation is achieved as a result of a higher packing density.

Amicra Mikrotechnologie GmbH in Regensburg, Germany, develops and manufactures Micro Assembly Cells designed for this purpose. These machines are known in particular for their high levels of accuracy and reliability. Depending on the model, they will mount micro-components with an accuracy of up to ±0.5 μm, achieving a process capability C_pk of 1.66.

The NovaPlus series from Amicra has been designed for maximum productivity. Using a large array of horizontal and vertical linear axes, they surface mount wafers with practically no unproductive downtime. While a component is being positioned, a second handling unit is already picking up the next component from a buffer store. At the same time, the work tables and other linear axes with lasers and UV lamps move to the positions required for the soldering and bonding processes. In addition, other axes position the integrated process monitoring cameras.

Collisions absolutely ruled out

NEW BALANCE