Texas Instruments Incorporated (TI) announced plans to expand its internal manufacturing footprint in Malaysia with two new assembly and test factories in Kuala Lumpur and Melaka. Together, these new investments will support TI’s plan to bring 90% of its assembly and test operations internal by 2030 to have greater control of supply.
YB Senator Tengku Datuk Seri Utama Zafrul Bin Tengku Abdul Aziz, Minister of Investment, Trade and Industry (MITI) said, "We are encouraged by Texas Instruments’ continued confidence in the Malaysian investment ecosystem. TI’s plans to expand its assembly and test operations reflect Malaysia’s clear positioning in the global semiconductor supply chain, while complementing our New Investment Policy and New Industrial Master Plan’s focus on attracting hi-tech, high value investments to support our increasingly digitized global and domestic economies. Further, TI’s expanded investment footprint in our country will not only bolster domestic value chains, but also create knowledge-based, high-income employment opportunities for Malaysians."
The timing of the expansion also aligns with Malaysia’s broader strategy of strengthening the semiconductor industry ecosystem and driving economic growth.
Datuk Wira Arham MIDA, Chief Executive Officer of the Malaysian Investment Development Authority (MIDA), reaffirmed MIDA’s commitment to facilitating TI’s expansion and fostering a collaborative ecosystem. He emphasized, "MIDA is fully dedicated to supporting TI’s expansion plans, which will not only bring significant investments but also enhanced analog and embedded processing manufacturing capabilities to the country. This partnership further solidifies Malaysia’s position as a leading hub in the region for semiconductor innovation."
The announced expansion reflects the joint efforts of TI, the Malaysian government, especially MITI and MIDA to reinforce Malaysia’s standing in the semiconductor industry. These initiatives aim to drive economic growth, attract investments, and foster knowledge exchange, contributing to the country’s overall development.
Yogannaidu Sivanchalam, Vice President, Assembly and Test Manufacturing Operations at TI said, "These investments are part of TI’s long-term strategy to expand our internal manufacturing capacity to support the increasing need for semiconductors and provide greater assurance of supply. TI is proud to have been operating in Malaysia for more than 50 years, and our decision to expand our back-end manufacturing is a reflection of the talented and growing team in Malaysia that will be critical to TI’s future."