(TIMTOS) Unveiled for the first time in Taiwan

Woody Wang, Managing Director, DMG Mori Seiki (Taiwan) Co. Ltd, said, “This is the first time DMG Mori Seiki is bringing the NVD1500 DCG HSC high-precision vertical compact machining center here in Taiwan, which is suitable for the mold & die market here. We think this is one of the markets we will have more growth. In the Taiwan market we call the mold & die market the 3 C: 1) Computer, Consumable, and Commodity. In this kind of market they need mold. And Taiwan is quite strong. Our company focus on high-accuracy.”

The NVD1500 DCG HSC has achieved revolutionary space savings with a machine width of only 850 mm (33.5 in.). That limited space is packed with various features for high precision, including one of the Mori Seiki’s original technologies of DCGTM (Driven at the Center of Gravity). This meets the requirements for the machining of dies and molds such as IC molds and connectors, and the machining of precision small parts such as electrodes, medical parts, and semi-conductors.

The NVD1500 DCG HSC comes with a high speed spindle with 24,000 rpm or optional 40,000 rpm and achieves maximum acceleration rates of 0.8 G (X- and Y-axis) and 1 G (Z-axis). The original DCGTM technology and isolating heat/vibration sources such as the control panel and spindle cooling oil controller from the machine body, controls vibration and thus ensures productivity without compromising on maximum precision.

The machine can be combined with an AWC (Automatic Workpiece Changer) which is compatible with unmanned night-time operation and is equipped with the high accuracy MAPPS IV operating system as a standard function. Its compact body and high-quality machining go beyond the conventional concept of machine tools.