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tna expands manufacturing into China

Source:Ringier Release Date:2012-01-13 438
Semiconductor/Electronic ChipSemiconductor / Electronic Chip

PACKAGING solutions specialist tna has further cemented its position as a leader in global packaging after recently unveiling its newest manufacturing plant in Qingdao, China. The plant, one of a series of new developments around the world, demonstrates the packaging company's commitment to both the China and Asian markets by providing local turnkey manufacturing solutions to its customers, said tna.
The new plant, which spans 7650m2, incorporates two separate factories and office space and follows a period of recent expansion across three continents. tna now produces its award winning end-of-line packaging solutions including the "robag 3" VFFS bagger and "roflo" distribution system in Australia, the United Kingdom and now China.
tna China is headed up by David Le Blanc.

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