Wacker releases thermally conductive adhesive for electronics

WACKER Chemicals Group has recently announced the SEMICOSIL (R) 975 TC thermally conductive adhesive for electronics applications.  

The new silicone rubber features high thermal conductivity and good flow and processing properties, ensuring an ultrathin adhesive layer between the contact surfaces even with just light pressure. It supports a minimum layer thickness of between 90 and 100 micrometers.  

In addition to good bonding, the one-component adhesive enables optimum heat dissipation through the heat sink. An ideal interface material for thermal and mechanical connections in power electronics components or packages, the SEMICOSIL 975 TC couples the electronic component to the heat sink. The thermal interface material in power electronics supports semiconductor devices such as insulated-gate bipolar transistors in engine control units and LED components on heat sinks in order to dissipate the heat.  

The addition-curing silicone rubber cures at more than 90°C. It is electrically insulating and adheres to many substrates employed in electronics devices. It boasts a high thermal conductivity of 4.3 W/mK per ASTM D5470.  

The SEMICOSIL 975 TC is a very pasty, nonsag material before curing but becomes progressively free-flowing with increased shearing. Because the product can be adjusted based on processing requirements, it can be fed at low pressure and applied as a bead. It can also be processed directly from the pail or from a regular cartridge.