Ways to achieve automated and sustainable production

Technical Closing Report – EMO Hannover 2023 Connectivity, sustainability and automation play a prominent role

Elkem celebrates 120 years

Elkem celebrates 120 years and continues to be one of the leading providers of advanced silicon-based materials

Plastic additives market forecast and demands

Forecasting a flourishing future: Plastic additives market set to reach US$ 66.6 billion valuation by 2032

The future of AI-powered intelligence, autonomy, connectivity & confidentiality

Electronics brand is driving the future across four themes of cutting-edge technologies

Portwell increases COM Express module portfolio

Portwell's PCOM-B65A module utilizes the new generation Intel Core Ultra processor and is based on the COM Express Basic size form factor.

TrendForce predicts mobile DRAM, eMMC/UFS prices to surge in 1Q 2024

TrendForce predicts a significant rise in the mobile DRAM and NAND Flash (eMMC/UFS) prices for the first quarter of 2024.

STMicroelectronics SiC Technology helps li auto accelerate toward high-voltage EV market

ST will provide Li Auto with SiC MOSFET devices to support its strategy around high-voltage BEVs in various market segments.

Outlook 2024: Product inspection market in Southeast Asia

In this article, Nigel Wong, Head of Market Support Centre at Mettler-Toledo, Asia Pacific looks back at new products released in 2023, as among highlights, and shares his views on what lies ahead this year.

Bosch, Infineon, Nordic, NXP, Qualcomm establish Quintauris to advance adoption of RISC-V

Based in Germany, Quintauris aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

IDC announces eight key trends for the global semiconductor market in 2024

The Semiconductor Market Will Recover in 2024 With an Annual Growth Rate of 20%, Says IDC

Taiwan's first 5G-ACIA general assembly unlocks global 5G market

The 5G Alliance for Connected Industries and Automation (5G-ACIA), the world’s largest 5G industrial alliance, held its annual General Assembly in Taiwan for the first time, drawing participation from industry heavyweights such as Bosch, Ericsson, Mitsubishi Electric, Nokia, Qualcomm, and Siemens.

ProPak Philippines to present total solutions for the packaging sector

Scheduled to take place from January 31 to February 2 in Manila, ProPak Philippines will present the latest technologies and information for the packaging sector.