Liebherr gets hands-on

Manual assembly stations are also needed for highly automated assembly lines in the automotive industry, not every assembly step can be automated in a productive or cost-effective manner.

Water-soluble packaging market size projection and trends

Water-soluble packaging market size is projected to hit US$5.34 billion by 2032

Maggie Liu Appointed as President of Ringier Trade Media

Maggie Liu will assume the role of President of Ringier Trade Media and Shanghai Ringier Events Co., Ltd., starting January 2, 2024, succeeding the founder Michael R. Hay (Mike).

Smart(er) Shop offers solutions for cybersecurity, rented robots, connected shops

What can you do about cybersecurity when you are both the shop staff and the IT staff? Could a rented robot solve inspection challenges? Are sticky notes your idea of shop communication? Take 10 minutes and find out how to address these issues and more by watching Season 2 of “Smart(er) Shop,” an IMTS+ Original Series, brought to you by Autodesk.

wheel.me adopts Siemens Xcelerator to drive the future of autonomous factory robotics

The Norwegian startup has adopted Siemens Xcelerator as a Service for the development of Genius 2, an autonomous mobile robot that brings automation and AI driven logistics to the shopfloor

Ways to achieve automated and sustainable production

Technical Closing Report – EMO Hannover 2023 Connectivity, sustainability and automation play a prominent role

Elkem celebrates 120 years

Elkem celebrates 120 years and continues to be one of the leading providers of advanced silicon-based materials

Plastic additives market forecast and demands

Forecasting a flourishing future: Plastic additives market set to reach US$ 66.6 billion valuation by 2032

The future of AI-powered intelligence, autonomy, connectivity & confidentiality

Electronics brand is driving the future across four themes of cutting-edge technologies

Portwell increases COM Express module portfolio

Portwell's PCOM-B65A module utilizes the new generation Intel Core Ultra processor and is based on the COM Express Basic size form factor.

TrendForce predicts mobile DRAM, eMMC/UFS prices to surge in 1Q 2024

TrendForce predicts a significant rise in the mobile DRAM and NAND Flash (eMMC/UFS) prices for the first quarter of 2024.

STMicroelectronics SiC Technology helps li auto accelerate toward high-voltage EV market

ST will provide Li Auto with SiC MOSFET devices to support its strategy around high-voltage BEVs in various market segments.