Videojet unveils next-gen Thermal Transfer Overprinters

The Videojet DataFlex® 6530 and 6330 thermal transfer overprinters (TTO) come with iAssure™ technology which reduces packaging waste as a result of coding errors

Renishaw provides HiETA with 3D printing solutions

The RenAM 500M is a laser powder-bed fusion additive manufacturing system designed specifically for the production of metal components on the factory floor.

ATI, GE Aviation form meltless titanium JV

The JV will construct a new R&D pilot production facility.

APRAS technology gets more attention in China

The technology enables production of premium chemical-free seafood 

Asian designs worth a WorldStar Award

Innovative designs from Indonesia, China and India receive awards at prestigious packaging competition

More than 20% of Medtec China 2017 are debut suppliers; a continuous stream of branded buyers registered to the show

Medtec China 2017 will take place 20-22 September 2017 at Shanghai World EXPO Exhibition & Convention Center. This year's show will gather more than 300 exhibitors from 23 regions and countries throughout the world, of which there are 50 companies originating from both China and abroad are participating for the first time in the show.

New sizes for Patented HoseGard™ Hose Support

  The Process Systems business unit of Saint-Gobain Performance Plastics has expanded its HoseGard portfolio to fit a wider range of hoses.

Azelis acquires food ingredients company

Azelis strengthens position in Australia and New Zealand as it acquires speciality chemicals and food ingredients provider, Chemcolour  

CBST2017 Beverage Show Visitor Invitation is in Progress

CBST2017 will be officially held at the Shanghai New International Expo Center from November 22 to 24 as the only and most influential industry chain exhibition of the China beverage industry. 

CROWN to showcase digital technologies at drinktec

 The company focuses on advances in digital technologies and decorative finishes for the beverage sector 

Adjustable Multibeam Antenna improves reliability of RFID systems

RFID systems accelerate Industry 4.0 processes. The Fraunhofer Institute for Integrated Circuits IIS has developed a Multibeam Antenna that can be integrated into existing systems and improve their reliability. Fraunhofer IIS is offering companies the chance to test the antenna in individual use case scenarios as pilot users, starting in August 2017.

Henkel opens Composite Lab in Japan

The Composite Lab enables Henkel customers and in-house experts to develop and test composite parts