Laser-assisted adhesive bonding of diamond cutting segments
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Description：
Bonding instead of soldering: The "Cutting and Joining of Metals" and "Safety Technology" groups at the LZH are collaborating with the Remscheid Institute for Tool Research and Materials (IFW) to research a laser-based process for replacing diamond cutting segments.
Unlike soldering, the heat input in laser-assisted bonding is significantly lower. This results in less stress in the saw blade and thus less distortion. Ideally, this means that in the future, no further straightening and tensioning of the saw blade will be necessary before reuse.
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