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Company Introduction
GRINTIMATE Precision Industry Co., Ltd. was established in 2015 and focuses on advanced hydrostatic grinding equipment. Through independently developed hydrostatic bearing technology, lubrication and cooling systems, and flow control solutions, the company enhances precision, stability, and processing efficiency in grinding applications.
Its product lines include multi-spindle wafer grinders, single-spindle wafer grinders, rotary surface grinders, and cylindrical grinders, along with customized hydrostatic solutions, grinding services, maintenance services, and one-stop technical support. Its hydrostatic technology enables non-contact operation, low wear, high load capacity, thermal stability, low vibration, low noise, and high precision, supporting demanding precision grinding and semiconductor wafer thinning applications.
GRINTIMATE continues to advance SiC wafer thinning equipment and semiconductor process applications by integrating hydrostatic core technology, ultrasonic-assisted processing, and dual-spindle architecture, delivering high-precision, stable, and efficient solutions for hard and brittle material processing.
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