POLYALLOY INC.

Polyalloy modifies thermoplastic materials to deliver specific electrical, mechanical, thermal and environmental performance. Its capabilities include conductive formulation, fibre reinforcement, impact modification, flame retardancy, reactive compatibilisation, weather resistance and recycled-material upgrading.

For semiconductor and electronics applications, the Etoma™ range provides conductive and electrostatic-dissipative properties for FOUPs, wafer carriers, IC trays, carrier tapes and transport containers. These applications require stable surface resistance, dimensional stability, mechanical strength and controlled material purity.

XuanWu™ engineering compounds use mineral, glass or carbon fibres to improve stiffness and mechanical performance. Additional formulations can provide flame resistance, toughness, low warpage, wear resistance, scratch resistance and weatherability for automotive, industrial, electrical and building applications.

PoLinker™ functional polymers improve compatibility and adhesion between different polymers, fibres, fillers and other substrates. They can be used as coupling agents, impact modifiers, adhesion promoters, tie layers and hot-melt adhesives.

VeryGreen™ and MassBlend™ address the transition toward lower-carbon materials through bio-based polymers, biodegradable compounds, recycled content and natural-fibre masterbatches. PolyLab™ supports customers with material sourcing, formulation, trial compounding, analysis and sample moulding, helping reduce development time and scale-up risk.