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Company Introduction
Hortech Company integrates laser technology, optics, precision mechanics and automation to provide both contract laser processing and customized laser equipment. Its product portfolio includes waterjet laser CNC machines, SiC wafer laser dicing systems, semiconductor wafer micro-coding machines, DUV laser systems, optical encoder scales and customized OEM/ODM laser machines. The company also provides precision laser cutting, drilling, etching and marking services for advanced materials and semiconductor components.
Hortech's technologies are used in semiconductor manufacturing, machine tools, robotics, precision metrology and advanced manufacturing. Recent applications include SiC and GaN wafer processing, Micro-LED processes, optical encoder scales and precision laser machining of hard and brittle materials such as diamond and sapphire.
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