3S Silicon Tech is focused on providing integrated process and equipment solutions for advanced power semiconductor packaging.
The company's capabilities extend from DOE and process validation to equipment and material integration, combining semiconductor process expertise with motion control, mechatronics and automation technologies.
Its vacuum and formic-acid reflow systems are designed to address critical packaging challenges such as void reduction and chip oxidation. These solutions are used in power module manufacturing and have also expanded into applications requiring high reliability, including low-earth-orbit satellite and advanced electronic module manufacturing.
3S also maintains sales and customer-service operations across several Asian markets, supporting international semiconductor manufacturers with localized technical services.

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