Wheat-based crumbs for crispy coatings

New Lory® Crumb varieties deliver perfect crunch for breaded products without frying

Innovative fabric made of unique cotton blend

Luminy® PLA powers Bioworks' innovative PlaX™ fabrics, entirely made from plants creating a unique blend of cotton

Husky Technologies announces leadership transition

Husky Technologies announces leadership transition: Bradley Selleck appointed CEO, John Galt to become Chairman

Food-safe coding & marking solutions for recyclable packaging

A collaborative project shows LEIBINGER’s CIJ ink and printer solutions are compatible for use on new food packaging materials from SÜDPACK.

Biomass Fermentation: Theme of MISTA’s second annual Growth Hack

Unique collaboration brings together 14 food-tech start-ups and 8 leading global food companies to innovate and co-create for the future of food

Energy efficient and more compact temperature controllers

The new Tempro basic E temperature controllers from WITTMANN offer still greater performance and energy efficiency inside a more compact housing. At the Fakuma 2024, they will celebrate their world premiere in size S90.

Electric allrounder with outstanding clamping force

Arburg at Fakuma 2024 features Allrounder 720 E Golden Electric: Slim in design and price

Rousselot announces two peer-reviewed publications strengthening peptan science

The key findings of a clinical trial confirming Peptan's effectiveness in enhancing skin beauty markers, along with a bioavailability study demonstrating its efficient absorption, will be presented at Vitafoods Asia (Bangkok, September 18-20, 2024).

Mettler-Toledo introduces next-level flexibility with combination inspection systems

Combining superior Sensitivity and precise weighing for enhanced quality control and product safety

Biomass-derived sustainable LCP solution

Polyplastics launches biomass balanced LCP for reduced CO2 emissions and improved renewable content

USEON’s EPLA obtains German DIN CERTCO certification

From Nature to Nature | USEON’s EPLA obtains German DIN CERTCO certification

Singapore, India strengthen semiconductor partnership with nnew MOU

Singapore and India formalized a Memorandum of Understanding (MOU) to collaborate in the semiconductor sector. This partnership aims to bolster India’s growing semiconductor industry while enabling Singapore’s ecosystem of semiconductor companies and related supply chains to engage in the rapidly expanding Indian market.