A powerful single-chip for next-gen robotics with vision AI, real-time control
New Generation AI Accelerator with 10 TOPS/W Power Efficiency Delivers AI Inference Performance of up to 80 TOPS Without Cooling Fan
2024-03-05 Renesas Electronics Corp.
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A powerful single-chip for next-gen robotics with vision AI, real-time control
New Generation AI Accelerator with 10 TOPS/W Power Efficiency Delivers AI Inference Performance of up to 80 TOPS Without Cooling Fan
2024-03-05 Renesas Electronics Corp.

Motor control solution for software-defined vehicle edge nodes
NXP Semiconductors N.V. has expanded its scalable S32 vehicle compute platform with the release of the S32M2, a purpose-built motor control solution optimized for efficiency improvement across vehicle applications such as pumps, fans, sunroof and seat position, seat belt pretensioners, trunk openers and more.
2024-03-05 NXP Semiconductors N.V.

Solid-state battery ecosystem for the electric two-wheeler
Blue Solutions, a Bolloré Group entity and global industrial-scale designer and manufacturer of solid-state batteries, has signed a memorandum of understanding (MoU) with Hon Hai Technology Group (Foxconn) and its subsidiary, SolidEdge Solution Inc., to jointly develop a solid-state battery ecosystem for the electric two-wheeler market.
2024-03-05 Hon Hai Technology Group (Foxconn)

STMicroelectronics' time-of-flight sensors empower 3D Depth sensing
STMicroelectronics has launched an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
2024-03-05 STMicroelectronics

Sanitary Vee-Cone blender equipped for liquid additions
Munson's Model VB-60-SSIS blends dry and granular bulk materials uniformly, with or without liquid additions, in 15 to 30 minutes typical.
2024-03-05 Munson Machinery Company, Inc.

MANA study alters existing computing architecture: Progressing organic circuits
Researchers from the Research Center for Materials Nanoarchitectonics (MANA) have developed a novel organic logic inverter circuit capable of handling four logical states. This advancement improves the data processing capabilities of organic integrated circuits.
2024-03-05 Materials Nanoarchitectonics (MANA)

Electronics and IC sales surge as industry recovery gains momentum
The global semiconductor manufacturing industry recovery is taking hold with electronics and IC sales increasing in the final quarter of 2023 and more growth projected for 2024, SEMI announced in its fourth quarter 2023 publication of the Semiconductor Manufacturing Monitor (SMM) report, prepared in partnership with TechInsights.
2024-03-05 SEMI

ASE buys Infineon's manufacturing sites in Philippines, South Korea
Infineon plans to divest two backend manufacturing facilities, with one located in the Philippines and the other in South Korea, to ASE Technology.
2024-03-05 Infineon Technologies AG

TrendForce: TSMC's JASM set to reshape Japan's semiconductor landscape
Japan's semiconductor industry is advancing at an impressive pace, with certain projects surpassing their anticipated schedules.
2024-03-05 TrendForce

Taiwanese firms collaborate to boost 5G access networking
Pegatron 5G, Aethertek, and Metanoia have joined forces to expedite the deployment in the FR2 market this year.
2024-03-05 Aethertek Technology

Automotive battery testing with AI
Richard Ahlfeld, CEO of Monolith AI, discusses the rising importance of battery testing for automotive applications and the application of AI and machine learning in this field.
2024-03-04 Hannover Messe

Recycled ocean-bound plastic for luxury caps and closures
Avient collaborates with Plastic Bank Recycling Corporation to formulate recycled ocean plastic into a new density modified polymer for luxury caps and closures
2024-03-04 Avient Corporation
GNT opens China office for plant-based EXBERRY® colors
ENGEL Group rolls out new all-electric machines outside Asia
CHINAPLAS: Husky showcases innovations that deliver sustainability, performance, value, and safety
Chyi Yang promotes energy-efficient blown film solutions at CHINAPLAS
2026-04-22
Reifenhäuser presents new generations of extrusion lines for the first time in China
2026-04-21
OQ brings expanded PP and PE portfolio to CHINAPLAS 2026
2026-04-21
Over 5,000 exhibitors converge at CHINAPLAS 2026 in Shanghai
2026-04-21
CHINAPLAS: Everlon presents innovative TPE/TPR applications
2026-04-21