interpack 2026: Sealpac on how to reduce packaging cost

With energy prices climbing, resources becoming scarce, costs tightening, and skilled workers in short supply, packaging lines have become more crucial to business decisions than ever. At interpack 2026 (at Stand D19, Hall 5), SEALPAC will demonstrate how its traysealers and thermoformers deliver cost savings in practice.

DRAM revenue surges 30% in Q4 2025 amid price rally

Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q 2025.

Extended OLED partnership strengthens display innovation

Universal Display has extended its long-term OLED material supply and license agreements with LG Display.

A female perspective on the food industry workplace

From ADM, Olive Tang, VP of Flavors, APAC, and Jingting Li, Talent Acquisition Director, APAC talk about their experiences, perspectives and the opportunities for women in the food industry.

Edge computing spend to hit $450B by 2029

Edge AI's impact is already visible across industrial automation, smart retail, connected vehicles, and next‑generation healthcare.

China drives global smartwatch growth in 2025

Global smartwatch shipments rebounded in 2025, growing by 4% year-on-year, according to Counterpoint Research.

200V BCD process boosts automotive & AI power ICs

A newly introduced 200V bipolar-CMOS-DMOS (BCD) process technology is designed to advance power ICs for automotive and AI applications. Supporting higher voltages with improved efficiency and reliability, it enables compact, high-performance solutions for electric vehicles, industrial systems, and AI hardware. By combining robust power handling with scalability, this innovation strengthens next-generation designs in mobility and intelligent electronics.

Next-gen vehicle architectures drive innovation

A new initiative is accelerating the development of next-generation vehicle electrical and electronic (E/E) architectures. Focused on software-defined vehicles, it enables greater integration, scalability, and efficiency across automotive systems. By supporting advanced connectivity, electrification, and autonomous features, this approach reduces complexity while enhancing performance, paving the way for smarter, safer, and more sustainable mobility solutions.

High-voltage gate driver advances power management

A new gate driver technology is engineered for high-voltage power management applications, delivering improved efficiency, reliability, and safety. Designed to handle demanding environments, it supports wide-bandgap devices like SiC and GaN, enabling faster switching speeds and reduced energy losses. With robust protection features and optimized performance, this innovation strengthens power systems across automotive, industrial, and renewable energy sectors.

Next-gen chip design and verification breakthroughs

A new frontier in semiconductor design and verification is emerging, driven by advanced tools that accelerate innovation and ensure reliability. This approach integrates AI, automation, and cloud-based collaboration to streamline complex chip development. By enhancing productivity, reducing errors, and enabling faster time-to-market, these technologies are reshaping how engineers create and validate the next generation of high-performance integrated circuits.

AI-accelerated MCUs drive edge intelligence in vehicles

A new automotive microcontroller introduces built-in AI acceleration, enabling edge intelligence for next-generation vehicles.

Advanced 3nm TCAM powers automotive SoCs

A new 3nm ternary content-addressable memory (TCAM) technology is set to transform automotive system-on-chips.

Semiconductor breakthroughs reshaping everyday experiences

This article highlights three key advances: safer systems that enhance reliability in critical applications, smaller devices that pack more power into compact designs, and the integration of artificial intelligence that enables smarter, more adaptive solutions. Together, these breakthroughs are redefining industries from consumer electronics to robotics, making life more convenient, efficient, and secure

The Estée Lauder Companies to acquire shares in Indian beauty brand

The announcement signals confidence in the continued relevance of Ayurveda in the luxury segment and positions Forest Essentials for broader international recognition.

Regular vitamin C intake: Impact on skin

Vitamin C in the blood circulation penetrates all layers of the skin and is associated with improved skin function

Chocolate honey extract breakthrough in food, cosmetics

A ready-to-use mixture of cocoa shells and native bee honey developed by scientists in Brazil will find applications in gourmet food and cosmetics, and the production technique helps reduce food waste.

Early life nutrition: DSM-firmenich gains new HMO approvals in Asia

DSM-firmenich continues its regulatory success in Asia’s early life nutrition market with approval of four new HMOs in Malaysia and Thailand alongside commercial authorization of its 3’-SL ingredient in China

interpack 2026: SOLLICH presents production processes and intelligent technologies for confectionery

From cleaning efficiency to AI-based assistance systems, SOLLICH equipment aim to improve confectionery processing for small batches to large-scale production

AI-powered platforms transform utility grid management

The article presents a unified AI-driven platform that integrates planning, operations, and asset management for utilities.

Cloud-powered AI simulations for smarter industry

The article introduces StrömungsRaum, a cloud-based, AI-supported simulation platform designed to deliver fast, accurate, and cost-efficient results.