Latest market research report for global vacuum packaging market 2024-2028

According to Technavio, the Vacuum Packaging Market size is set to grow by USD 7.93 billion from 2024-2028 due to increasing awareness about food safety and hygiene

Sidel delivers C’estbon Beverage’s expansion into large water bottle formats

China Resources C’estbon Beverage Co. Ltd has chosen Sidel's innovative complete line packaging solution to help deliver its expansion in big format water production

Revolutionary solutions for enhancing the efficiency of robotic arms

In modern automation and precision manufacturing, the stability and efficiency of robotic arms (both humanoid and industrial) are crucial. As fundamental components in circuits, capacitors play a vital role in the performance of robotic arms.

SiC wafer cutting speed up to 100 times faster than dicing

New Process to Revolutionize SiC Wafer Cutting “Common Sense of Glass Processing” to Challenge Semiconductor Market

The key to agile and secure Industry 4.0 advancements

FPGAs are quickly becoming the tool of choice for developers to meet these demands and keep pace with the Industry 4.0 revolution.

AEM intros automated burn-in systems for AI, HPC chip testing

AMPS-BI performs accelerated high voltage stress testing on advanced semiconductor devices such as AI processors and HPC units.

Microchip MPU designed for autonomous space computing

The world has changed dramatically in the two decades since the debut of what was then considered a trail-blazing space-grade processor used in NASA missions such as the comet-chasing Deep Impact spacecraft and Mars Curiosity rover vehicle.

ESD Alliance: Electronic system design industry posts $4.5B in revenue in 1Q 2024

Electronic system design (ESD) industry revenue reached $4.521 billion in the first quarter of 2024, up by 14.4% year-on-year.

Thermo Fisher builds first electron microscopy demo center in Taiwan

Thermo Fisher has opened its first electron microscopy demo center in Taiwan to support next-gen semiconductor and materials innovation in the region.

Keysight enhances 5G Field-to-Lab Workflow for Samsung Semiconductor India Research

Samsung has selected Keysight's Signaling Field-To-Lab solution to streamline and automate its 5G field-to-lab workflow in its Bengaluru lab.

Blake Hu Appointed VP and Country Manager of Greater China and Southeast Asia for Morse Micro

Morse Micro has appointed Blake Hu as the new Vice President and Country Manager of Greater China and Southeast Asia.

Lummus and MOL announces design phase for advanced recycling unit

Lummus and MOL Group begin engineering execution on advanced waste plastic recycling plant in Hungary