Strengthening value-added films production with cutting edge solutions

Cosmo First recently announced the launch of its new business division: Cosmo Plastech, a strategic move that is in line with the company's vision of offering diverse extrusion solutions.

Innovative CS architecture unifies hardware emulation, enterprise, software prototyping

Time to market is critical to the entire Arm partner ecosystem, emphasizing a need for tools that offer modularity, granularity and speed for IP and SoC verification. Siemens' Veloce platforms have become an integral part of the Arm development process and we continue to see benefits of the new Veloce Strato CS system for hardware design acceleration and software development.

A powerful single-chip for next-gen robotics with vision AI, real-time control

New Generation AI Accelerator with 10 TOPS/W Power Efficiency Delivers AI Inference Performance of up to 80 TOPS Without Cooling Fan

Motor control solution for software-defined vehicle edge nodes

NXP Semiconductors N.V. has expanded its scalable S32 vehicle compute platform with the release of the S32M2, a purpose-built motor control solution optimized for efficiency improvement across vehicle applications such as pumps, fans, sunroof and seat position, seat belt pretensioners, trunk openers and more.

Solid-state battery ecosystem for the electric two-wheeler

Blue Solutions, a Bolloré Group entity and global industrial-scale designer and manufacturer of solid-state batteries, has signed a memorandum of understanding (MoU) with Hon Hai Technology Group (Foxconn) and its subsidiary, SolidEdge Solution Inc., to jointly develop a solid-state battery ecosystem for the electric two-wheeler market.

STMicroelectronics' time-of-flight sensors empower 3D Depth sensing

STMicroelectronics has launched an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

Sanitary Vee-Cone blender equipped for liquid additions

Munson's Model VB-60-SSIS blends dry and granular bulk materials uniformly, with or without liquid additions, in 15 to 30 minutes typical.

MANA study alters existing computing architecture: Progressing organic circuits

Researchers from the Research Center for Materials Nanoarchitectonics (MANA) have developed a novel organic logic inverter circuit capable of handling four logical states. This advancement improves the data processing capabilities of organic integrated circuits.

Electronics and IC sales surge as industry recovery gains momentum

The global semiconductor manufacturing industry recovery is taking hold with electronics and IC sales increasing in the final quarter of 2023 and more growth projected for 2024, SEMI announced in its fourth quarter 2023 publication of the Semiconductor Manufacturing Monitor (SMM) report, prepared in partnership with TechInsights.

ASE buys Infineon's manufacturing sites in Philippines, South Korea

Infineon plans to divest two backend manufacturing facilities, with one located in the Philippines and the other in South Korea, to ASE Technology.

TrendForce: TSMC's JASM set to reshape Japan's semiconductor landscape

Japan's semiconductor industry is advancing at an impressive pace, with certain projects surpassing their anticipated schedules.

Taiwanese firms collaborate to boost 5G access networking

Pegatron 5G, Aethertek, and Metanoia have joined forces to expedite the deployment in the FR2 market this year.