Klüber Lubrication acquires TriboServ

Speciality lubricants producer, Klüber Lubrication has acquired TriboServ GmbH & Co. KG, specialist in automatic lubricators and customized lubrication systems.

Syntegon delivers strong growth and EBITDA improvements in Q1 2025

In first half of 2025, driven by the strong momentum in its Pharma segment, Syntegon achieved sales of €824m, +11% growth compared to prior year.

Next-generation recyclable snack pouches

At FACHPACK, SÜDPACK showcases how mono-PE stand-up pouches with an integrated PE zipper can be produced efficiently on a standard horizontal pouch packaging machine,

Smoked sausage casing: First thermoplastic polyamide with high water permeability

BASF makes it possible for smoked sausages to be produced in an artificial casing made of pure polyamide for the first time

From fuel to future: The evolution of Indonesia’s two-wheeler market

Indonesia’s two-wheeler market has long been one of the largest and most dynamic in the world.

Navigating complexity through innovation

At the heart of Detroit’s innovation hub, Siemens gathered global media, partners, and industry leaders for Realize LIVE 2025—a premier event showcasing the future of digital manufacturing.

Food-grade lubricants going halal

Developments in food-grade lubricant production

China to dominate global display capacity by 2028

China is still expected to dominate global display capacity, growing from a 68% share in 2023 to 75% in 2028.

Taiwan strengthens semiconductor industry ties with Northern Poland

Pomerania is partnering with Taiwan in strengthening its semiconductor Industry.

Indonesia smartphone shipments down 7% YoY in 2Q 2025

Indonesia’s smartphone shipments declined by 7% year-on-year (YoY) in the second quarter (2Q 2025), hurt by weaker demand and economic uncertainties, according to Counterpoint Technology Market Research’s Monthly Indonesia Smartphone Tracker.

BSE expands test and back-end portfolio through Asian OEM partnership

The agreement allows BSE to expand its tool offerings and support a broader range of customer needs across test and back-end manufacturing.

EV Group unveils high-throughput D2W metrology for chiplet and 3D integration

EVG's EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield.