Next-generation recyclable snack pouches

At FACHPACK, SÜDPACK showcases how mono-PE stand-up pouches with an integrated PE zipper can be produced efficiently on a standard horizontal pouch packaging machine,

Smoked sausage casing: First thermoplastic polyamide with high water permeability

BASF makes it possible for smoked sausages to be produced in an artificial casing made of pure polyamide for the first time

From fuel to future: The evolution of Indonesia’s two-wheeler market

Indonesia’s two-wheeler market has long been one of the largest and most dynamic in the world.

Navigating complexity through innovation

At the heart of Detroit’s innovation hub, Siemens gathered global media, partners, and industry leaders for Realize LIVE 2025—a premier event showcasing the future of digital manufacturing.

Food-grade lubricants going halal

Developments in food-grade lubricant production

China to dominate global display capacity by 2028

China is still expected to dominate global display capacity, growing from a 68% share in 2023 to 75% in 2028.

Taiwan strengthens semiconductor industry ties with Northern Poland

Pomerania is partnering with Taiwan in strengthening its semiconductor Industry.

Indonesia smartphone shipments down 7% YoY in 2Q 2025

Indonesia’s smartphone shipments declined by 7% year-on-year (YoY) in the second quarter (2Q 2025), hurt by weaker demand and economic uncertainties, according to Counterpoint Technology Market Research’s Monthly Indonesia Smartphone Tracker.

BSE expands test and back-end portfolio through Asian OEM partnership

The agreement allows BSE to expand its tool offerings and support a broader range of customer needs across test and back-end manufacturing.

EV Group unveils high-throughput D2W metrology for chiplet and 3D integration

EVG's EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield.

Renesas launches ultra-low-power MCU with advanced security for smart devices

Renesas' RA4C1 offers ultra-low power consumption, advanced security features, abundant communication interfaces, and segment LCD support.

Sustainable cooling powers the future of data centers

As AI and high-performance computing drive massive data growth, data centers face rising heat challenges from advanced CPUs and GPUs. Traditional air cooling is no longer enough, pushing liquid cooling and other innovations to the forefront.