A machining robot that bridges the gap between industrial robots and machine tools

Newly developed milling kinematics from Fraunhofer IFAM enable highly versatile, efficient, and ultra-precise machining—from fibre composites and aluminium to tempered steel—with manufacturing tolerances of up to 0.1 millimetres.

Standard creates PCF transparency for precision tools

In the precision tool industry, demand for verified Product Carbon Footprint (PCF) data has never been higher.

ADM and Bayer quadruple reach to 100,000 soybean farmers in Maharashtra

The renewed partnership will expand reach to 100,000 farmers through Farmer Producer Organizations, and over the next three years scale soybean cultivation to 200,000 hectares, and extend coverage to seven districts.

SEMIFIVE wins AI Chip design projects in Japan

Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC

Memory Price Surge Hits Game Console Shipments

Memory Price Surge Squeezes Game Console Margins; 2026 Shipment Forecast Revised Downward, Says TrendForce

Global Semiconductor Equipment Sales to Hit Record US$156B by 2027

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027

Keysight teams up with Singapore to push Qubit Innovation

Keysight Technologies, Inc. announced the signing of a five-year Master Research Collaboration Agreement (MRCA) with Singapore’s leading quantum research institutions: Agency for Science, Technology and Research (A*STAR), the National University of Singapore (NUS) through the Centre for Quantum Technologies (CQT), and Nanyang Technological University, Singapore (NTU Singapore), to advance capabilities in quantum computing. This collaboration covers the design, measurement, and control of qubits.

UMC Expands Silicon Photonics Capabilities with imec’s iSiPP300 Technology

UMC has licensed imec’s iSiPP300 silicon photonics technology to accelerate its 12-inch photonic platform for next-generation connectivity.

STMicroelectronics powers up NB-IoT

STMicroelectronics is boosting cellular IoT with two new NB-IoT modules and an enhanced development ecosystem that simplifies smart device design.

Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

The S-SiCapTM product line covers two types: Discrete Devices and InterPoser with silicon Capacitor (IPC), which correspond to different system architectures and application scenarios to meet diverse design needs

Wolfspeed supercharges Toyota’s EV platforms with silicon carbide power

Wolfspeed announced that its silicon carbide automotive MOSFETs will power onboard charger systems in Toyota’s battery electric vehicles.

Certus taps AI to fast-track analog and ESD IP

Siemens announced that Certus Semiconductor has adopted Solido to accelerate IO library, ESD and analog IP development for automotive, aerospace, AI and IoT applications.