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Crafting tomorrow's AI landscape

Intel is painting a future AI accelerator competitive landscape with three viable options: itself, AMD and, of course, Nvidia.

Semiconductor / Electronic ChipElectronic Design Automation (EDA) Electronic chip manufacturing

2024-05-07

dsm-firmenich to unveil biotic vitamin Humiome® B2 at Vitafoods 2024

Humiome® B2 is the first ‘biotic’ vitamin powered by patented Microbiome Targeted Technology™

Food & BeverageFood & Beverage Ingredients IngredientsTradeshow Preview/Review

2024-05-07 dsm-firmenich

Schenck Process FPM will transition its name under Coperion

Effective 1 August 2024, Schenck Process will officially transition its name and brand under Coperion

Food & BeverageFood Processing & Equipment Industry Updates

2024-05-07 Coperion

AST breaks ground in Singapore for high-end substrates & advanced tech

AST recently broke ground for the construction of a FC-BGA substrate factory on Pesawat Drive near Jurong Lake District.

Semiconductor / Electronic ChipElectronic Design Automation (EDA) Electronic chip manufacturing

2024-05-07

Infineon strengthens position in automotive semiconductor market

Infineon's overall market share increased by one percentage point, from nearly 13% in 2022 to about 14% in 2023, solidifying its position as the global leader in the automotive semiconductor market.

Semiconductor / Electronic ChipElectronic Design Automation (EDA) Electronic chip manufacturing

2024-05-07 Infineon Technologies AG

Charting the Path: Taiwan's 2024 breakthrough in AI integration

The New Paradigm of Enterprise AI: Comprehensive Expansion and Twin Transformation for an Intelligent Green Future

Semiconductor / Electronic Chip AutomationElectronic chip manufacturing

2024-05-07 Profet AI

China gears up 2024 ADAS market

China will be the main driver regionally considering the size and advanced state of its domestic PV market.

Semiconductor / Electronic Chip Electronic chip manufacturing

2024-05-06 Counterpoint Technology Market Research

UMC offers 3D IC solution for RFSOI

Available on UMC's 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of RF performance.

Semiconductor / Electronic ChipElectronic Design Automation (EDA) Electronic chip manufacturing

2024-05-06 United Microelectronics Corp.

Lower integration efforts for large-surface laser micromachining setups

New partnerships provide product developers and manufacturers easy pathways to test and implement XL SCAN worldwide

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals Electronic chip manufacturing

2024-05-06

Ansys, TSMC to enable multiphysics platform for optics and photonics

Ansys is collaborating with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE).

2024-05-06 Taiwan Semiconductor Manufacturing Co. Ltd

Gstar to build silicon wafer factory in Indonesia

Gstar Solar recently held a groundbreaking ceremony for its silicon rod and silicon wafer factory in Jakarta, Indonesia.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals Electronic chip manufacturing

2024-05-06

Intuitive programming on the motion control platform

The motion control experts at Aerotech continuing to add new features to their Automation1 motion control platform: Release 2.7 is now available as the latest version of the Automation1 Motion Development Kit (MDK) and the Automation1 iSMC Intelligent Software-Based Motion Controller (iSMC).

Semiconductor / Electronic Chip Electronic chip manufacturingAutomation

2024-05-06 Aerotech

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