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Connected quality platform streamlines automotive inspection and traceability

Connected quality platform streamlines automotive inspection and traceability

A connected quality platform helps automotive manufacturers automate inspection planning, PPAP reporting and measurement-data collection while maintaining complete traceability from design through production and final delivery.

MetalworkingMeasuring & Control System AutomotiveMetrology

2026-09-15 High QA

MAG horizontal machining center boosts automotive production efficiency

MAG horizontal machining center boosts automotive production efficiency

Built for continuous automotive production, MAG’s Specht 500 NG horizontal machining center combines positioning accuracy, flexible automation and energy-saving technology to increase uptime, shorten cycle times and maintain part quality.

MetalworkingMetal Cutting Machine Tools AutomotiveMachine Tools

2026-09-15 MAG Automotive

Kennametal delivers end-to-end machining solutions for automotive manufacturers

Kennametal delivers end-to-end machining solutions for automotive manufacturers

Kennametal combines turning, milling and holemaking tools with digital machining, engineering support and scrap recycling services—helping automotive suppliers improve productivity, solve application challenges and strengthen profitability.

MetalworkingMetal Cutting Machine Tools Tooling & WorkholdingAutomotive

2026-09-15 Kennametal

Prima Power 3D laser systems address complex automotive manufacturing needs

Prima Power 3D laser systems address complex automotive manufacturing needs

Prima Power’s five-axis 3D laser systems help automotive manufacturers cut, weld and drill complex components with precision. Integrated automation and intelligent software support consistent quality, higher throughput and fewer secondary operations.

MetalworkingMetal Cutting Machine Tools Automotive

2026-09-15 Prima Power Laserdyne

Ceratizit digital twin enhances automotive machining efficiency

Ceratizit digital twin enhances automotive machining efficiency

Ceratizit’s Visual Twin lets automotive manufacturers test machining strategies virtually—helping identify problems before production, reduce scrap and tool changes, conserve materials, and improve machine utilization.

2026-09-15 Ceratizit

Laserax takes a majority stake in Germany-based SLCR Lasertechnik

Laserax takes a majority stake in Germany-based SLCR Lasertechnik

The strategic partnership strengthens Laserax's position as a global leader in industrial laser solutions, expands its manufacturing footprint and gives customers access to some of the industry's most advanced laser solutions.

MetalworkingSpecialty Processing (Laser Processing, EDM, Plasma Arc Processing, ECM) Automotive

2026-09-14 Laserax

Kerry to share innovative concepts and strategic insights at Fi Asia Indonesia

Kerry to share innovative concepts and strategic insights at Fi Asia Indonesia

At Stand D1A06 [Hall 1], Kerry features innovation across dairy, beverages, meat, savory flavors, and digestive health. The company will also host five technical seminars on September 16 and 17.

Food & BeverageFood & Beverage Ingredients IngredientsHealth & Nutrition

2026-09-14

Prosur showcases clean-label solutions for Asia’s “new food rules”

Prosur showcases clean-label solutions for Asia’s “new food rules”

Prosur will showcase its natural ingredient solutions at FI Asia, demonstrating how manufacturers can “protect food with food” to meet growing demand for cleaner labels in Asia.

Food & Beverage Tradeshow Preview/Review

2026-09-14 Prosur

Southeast Asia advances food reformulation through policy and consumer demand

Southeast Asia advances food reformulation through policy and consumer demand

Fi Asia Indonesia 2026 offers a platform to discover the latest ingredients, technologies, and formulation solutions. The event takes place from September 16-18, 2026 at the JIExpo, Jakarta.

Food & BeverageFood & Beverage Ingredients Industry UpdatesTradeshow Preview/Review

2026-09-14 Fi Asia Indonesia

Taiyo Advances Semiconductor packaging with 700-nm RDL Formation on 12-inch Wafers

Taiyo Advances Semiconductor packaging with 700-nm RDL Formation on 12-inch Wafers

Taiyo Holdings has pushed advanced packaging toward submicron interconnects, forming a three-layer RDL with 700-nm lines and vias on 12-inch wafers. Discover how its novel FPIM material and dual-damascene process could enable denser, higher-performance AI chips and next-generation devices globally.

Semiconductor / Electronic ChipSemiconductor Packaging Equipment

2026-09-14

Redefining storage as AI’s persistent memory layer

Redefining storage as AI’s persistent memory layer

Redefining Storage as AI’s Persistent Memory Layer

Semiconductor / Electronic ChipSemiconductor Process Equipment

2026-09-14 Silicon Motion Technology Corporation

New space economics reshape electronics design for scalable LEO constellations

New space economics reshape electronics design for scalable LEO constellations

Reusable launches and expanding LEO constellations are rewriting the rules of satellite electronics. Discover how engineers are balancing cost, radiation tolerance, power, thermal demands and performance—and why system resilience is replacing the traditional zero-failure design model at true scale.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2026-09-14 Arrow Electronics