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Bioiberica, Ryusendo Co., Ltd. to bring joint health benefits of Collavant® n2 to Japanese market

Bioiberica, Ryusendo Co., Ltd. to bring joint health benefits of Collavant® n2 to Japanese market

Collavant® n2 will become Bioiberica’s first branded nutraceutical ingredient to be launched in Japan.

Personal Care Industry Updates

2026-07-17 Bioiberica

Alfa Laval deepens opens with new Food & Pharma division

Alfa Laval deepens opens with new Food & Pharma division

Alfa Laval creates an organization with sharpened focus and greater innovation muscle, to become the food industry's most capable and future-ready partner even stronger.

Food & BeverageFood Processing & Equipment Industry UpdatesProcessing

2026-07-17 Alfa Laval

Singapore ranks among World’s Ten Most Food-Resilient Nations

Singapore ranks among World’s Ten Most Food-Resilient Nations

Latest global index finds that Singapore leads Southeast Asia on affordability, safety and supply chain innovation.

Food & Beverage Industry UpdatesMarket Trends

2026-07-17 The Economist Enterprise

Wine entrepreneur named president of Barcelona Wine Week

Wine entrepreneur named president of Barcelona Wine Week

The Board of Directors of Fira de Barcelona has appointed the current president of the Regulatory Council of the Rioja Qualified Designation of Origin (DOCa), Raquel Pérez Cuevas, as president of the Organizing Committee of Barcelona Wine Week 2027

Food & Beverage Industry UpdatesBrewing

2026-07-17 DOCa Rioja

GEA and CST partner to drive sugar industry transition

GEA and CST partner to drive sugar industry transition

GEA and Chemical Systems Technologies (CST), an India-based engineering company specializing in process solutions for the sugar industry, have entered into a strategic partnership to accelerate the global adoption of decanter centrifuges in sugar mud dewatering.

Food & BeverageFood Processing & Equipment Industry UpdatesProcessing

2026-07-17 GEA

Why bringing GaN manufacturing in-house matters more than ever

Why bringing GaN manufacturing in-house matters more than ever

As AI servers, EVs and energy-efficient power systems push power demands higher, GaN is becoming a strategic technology for semiconductor manufacturers. ROHM's move to internalize production reflects a broader industry trend toward securing advanced manufacturing capabilities and supply resilience.

Semiconductor / Electronic Chip

2026-07-16 ROHM

Samsung commences mass production of PCIe 6.0-based eSSD

Samsung commences mass production of PCIe 6.0-based eSSD

Samsung's latest eSSD features 9th-generation V-NAND, 4nm controller and liquid-cooling optimization to support demanding AI workloads.

Semiconductor / Electronic ChipIntelligent Automation Artificial Intelligence & Machine Learning

2026-07-16

Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand

Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand

The company scales manufacturing of SiP-based Micro SSDs as demand grows for compact, high-performance storage in AI PCs and intelligent edge devices.

Semiconductor / Electronic Chip

2026-07-16 Longsys

Applied Materials expands Singapore manufacturing to support AI chip demand

Applied Materials expands Singapore manufacturing to support AI chip demand

New state-of-the-art facility strengthens Applied’s global manufacturing and R&D capabilities to drive resilience and scalability

Semiconductor / Electronic ChipIntelligent Automation Artificial Intelligence & Machine Learning

2026-07-16 Applied Materials, Inc.

Electronic system design industry revenue up 13% in 1Q 2026

Electronic system design industry revenue up 13% in 1Q 2026

The electronic design automation industry continued to report strong year-over-year revenue growth in 1Q 2026.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2026-07-16 ESD Alliance

AI Is fueling Lintes' next growth phase—and its biggest product push yet

AI Is fueling Lintes' next growth phase—and its biggest product push yet

Lintes Technology is accelerating its AI strategy with next-generation high-speed interconnect solutions and expanded automated manufacturing

Semiconductor / Electronic ChipIntelligent Automation Artificial Intelligence & Machine Learning

2026-07-16 Lintes Technology

See More, Compute Less: ST's new 3D LiDAR targets the next wave of edge AI

See More, Compute Less: ST's new 3D LiDAR targets the next wave of edge AI

STMicroelectronics has launched the VL53L9, its first direct Time-of-Flight 3D LiDAR module, bringing high-resolution depth sensing to compact edge AI systems.

Semiconductor / Electronic ChipIntelligent Automation

2026-07-16 STMicroelectronics