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UMC Expands Silicon Photonics Capabilities with imec’s iSiPP300 Technology

UMC Expands Silicon Photonics Capabilities with imec’s iSiPP300 Technology

UMC has licensed imec’s iSiPP300 silicon photonics technology to accelerate its 12-inch photonic platform for next-generation connectivity.

Semiconductor / Electronic Chip

2026-01-02 United Microelectronics Corp.

STMicroelectronics powers up NB-IoT

STMicroelectronics powers up NB-IoT

STMicroelectronics is boosting cellular IoT with two new NB-IoT modules and an enhanced development ecosystem that simplifies smart device design.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2026-01-02 STMicroelectronics

Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

The S-SiCapTM product line covers two types: Discrete Devices and InterPoser with silicon Capacitor (IPC), which correspond to different system architectures and application scenarios to meet diverse design needs

Semiconductor / Electronic ChipIntellectual Property (IP) based Electronic Design Automation (EDA) software

2026-01-02 AP Technology

Wolfspeed supercharges Toyota’s EV platforms with silicon carbide power

Wolfspeed supercharges Toyota’s EV platforms with silicon carbide power

Wolfspeed announced that its silicon carbide automotive MOSFETs will power onboard charger systems in Toyota’s battery electric vehicles.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals Automotive

2026-01-02 Wolfspeed

Certus taps AI to fast-track analog and ESD IP

Certus taps AI to fast-track analog and ESD IP

Siemens announced that Certus Semiconductor has adopted Solido to accelerate IO library, ESD and analog IP development for automotive, aerospace, AI and IoT applications.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2026-01-02 Siemens Digital Industries Software

Automotive chips race toward US$100B by 2029

Automotive chips race toward US$100B by 2029

Rapid advances in vehicle electrification and intelligence are driving strong growth in the global automotive semiconductor market, rising from US$67.7 billion in 2024 to nearly US$96.9 billion by 2029.

Semiconductor / Electronic Chip

2026-01-02 TrendForce

Outlook 2026: Consumer trends shaping beauty and personal care

Outlook 2026: Consumer trends shaping beauty and personal care

The ASEAN beauty and personal care market is evolving rapidly, with tech-driven innovation as the catalyst for achievement

Personal CareRaw Materials & Ingredients Market TrendsIndustry Updates

2026-01-02 Ringier Beauty and Personal Care

New research centre aims to transform healthcare with wearable ultrasound technology

New research centre aims to transform healthcare with wearable ultrasound technology

The Wearable Imaging for Transforming Elderly Care (WITEC) research project aims to develop the world’s first wearable ultrasound imaging system for continuous, real-time monitoring and personalised diagnosis of chronic conditions such as hypertension and heart failure.

Semiconductor / Electronic Chip

2026-01-02 SMART WITEC

Outlook 2026: Plant-based additives to achieve regulatory compliance

Outlook 2026: Plant-based additives to achieve regulatory compliance

Mr. Kenneth Heng, Sales Manager for Bio-Speciality Additives at Palsgaard, shares how increased regulatory compliance for plastics to achieve circular economy will impact the company's portfolio in 2026.

Plastics & RubberRaw Materials & Compounds Special Report

2025-12-31 International Plastics News for Asia

SACMI acquires majority stake in Groupe Emballage Technologies

SACMI acquires majority stake in Groupe Emballage Technologies

This operation strengthens and expands SACMI's reach in the food packaging sector. President Paolo Mongardi states: “In line with our strategic vision, this acquisition further strengthens our presence in France and other countries.”

Plastics & RubberPlastics Machinery Enterprise Closeup

2025-12-31 Sacmi

Outlook 2026: Enhancing core strengths in blown film extrusion

Outlook 2026: Enhancing core strengths in blown film extrusion

For Mr. Kun Lin Tsai, Vice President of Kung Hsing Plastic Machinery, the next few years will see the company focusing on enhancing its core strengths in blown film extrusion in order to remain competitive.

Plastics & RubberPlastics Machinery Special Report

2025-12-26 Zhuo Peng, International Plastics News for Asia

Outlook 2026: Game-changer materials for e-mobility applications

Outlook 2026: Game-changer materials for e-mobility applications

Mr. Bert Havenith, Director of Strategy, M&A and Marketing Intelligence at Envalior, shares how regulatory landscape is becoming more complex for manufacturers in this Outlook 2026 article.

Plastics & RubberRaw Materials & Compounds Special Report

2025-12-26 International Plastics News for Asia