When Mechanics Become Yield-Critical: Motion Design for the Advanced Packaging Era
As advanced packaging enters the era of nanometer-scale alignment, motion control has evolved from a supporting device to a core factor determining production yield. When tolerances shrink from the micron level to tens of nanometers, previously overlooked factors—such as vibration, thermal drift, and mechanical flexibility—directly cause bonding defects, alignment errors, and other quality issues.

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