How electronics companies can use low-code to remove digital transformation roadblocks

In this E-book, you will learn: -The challenges faced by electronics industry -What is needed to meet the challenges -How low-code fits in the solution to remove roadblocks

How low-code can change the ways electronics companies go to market

Here are some areas where electronics companies can explore how low-code apps could fit into their business processes to gain a competitive edge and speed up their digitalization journey.

Digital and Sustainable

As our white paper shows, a digital logistics network offers many opportunities for green logistics: By running fewer empty trucks. By making warehouses more energy-efficient. By finding reusable solutions. So let’s take the first step and make logistics a bit greener. Download the white paper now.

The Circular Economy

Learn how to find a well-rounded solution for the circular economy in the whitepaper “The Circular Economy”—available for download here.

Smart Manufacturing in Food & Beverage

Discover how your food and beverage company can stay ahead by adopting a flexible and predictable smart manufacturing approach. Lead the way in the industry with innovative strategies for success. 

Imperatives as Automotive Industry Pivots to Vehicle Electrification

Discover why CIMdata, a global leader in PLM consulting, recommends automotive companies consider Siemens technology platforms when evaluating needs and solutions for vehicle electrification engineering and manufacturing. Read the white paper to learn more. 

The Value of Vehicle Electrification

Read this ebook to learn how Siemens can help you develop the next generation of safe and reliable electric vehicles with a mass-market appeal to drive change for mobility. 

Video: Enterprise Recipe Management for consumer packaged goods - Streamline your recipe development process

Transform your recipe development process with Siemens Enterprise Recipe Management. 

VIDEO: CPR manufacturing and recipe generation - Recipe management for cold brew coffee

In the competitive world of Consumer Packaged Goods (CPG), recipe management plays a crucial role in delivering consistent, 

From idea to shelf: Transforming the CPG industry with digital enterprise recipe management

Download Siemens’ infographic to learn how you can transform your CPG business with a digital enterprise recipe management solution.

Digital Recipe Transformation

Learn more about how Enterprise Recipe Management technology is a key component to drive future success for consumer packaged goods manufacturers with this latest white paper from Incisiv and Siemens.

Digital Recipe Transformation

Learn more about how Enterprise Recipe Management technology is a key component to drive future success for consumer packaged goods manufacturers with this latest white paper from Incisiv and Siemens.

Design faster and better with electronics simulation-driven design to shift left

In this ebook, learn more about developing a shift left strategy with electronics simulation-driven design.

Grow confidence in thermal management with thermal simulations before production

Ten tips for predicting component temperatures

Ten tips for streamlining PCB thermal design

Many aspects of a printed circuit board’s (PCB) performance are determined during detailed design, for example, making a trace a specific length for timing reasons. 

Discover the power of cloud-based PLM for Semiconductor industry

With the world changing faster than ever, semiconductor industry today is faced with numerous challenges to stay relevant and competitive. These challenges involve a new, distributed workforce, complex projects and the need to innovate at the pace of the market.

The pressure is on for test engineers

How to improve their jobs while ensuring high product quality and manufacturing yields

How to reduce new product introduction (NPI) times for a shorter time to market

Accelerating new product introduction (NPI) and getting to market faster will continue to challenge chipmakers as new markets emerge and technologies expand demand. 

Proposed standardization of chiplet models for heterogeneous integration

In this paper, the authors, as members of the Chiplet Design Exchange (CDX)— a working group under the Open Domain-Specific Architecture (ODSA) sub-project under the direction of the Open Compute Project Foundation (OCP) — propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.

Digital transformation for smart semiconductor manufacturing

Manufacturing is a great place to start with digital transformation implementation. By starting with manufacturing, teams can deliver bottom-line results. Download this ebook to learn how digital transformation impacts