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Proposed standardization of chiplet models for heterogeneous integration

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Source:Siemens Digital Industries Software

Release Date:2023-03-21


In this paper, the authors, as members of the Chiplet Design Exchange (CDX)— a working group under the Open Domain-Specific Architecture (ODSA) sub-project under the direction of the Open Compute Project Foundation (OCP) — propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.