Kellenberger expands its grinding portfolio in the entry-level segment

The Swiss grinding specialist Kellenberger is presenting two new cylindrical grinding machines at the Grinding Hub fair in Stuttgart – the KELLENBERGER K8 and the KELLENBERGER K10 – significantly expanding its machine portfolio for beginners and smaller companies.

AI-Driven Innovations to Take Center Stage at the 2026 Beauty Technology & Industry Innovation Forum in Hangzhou

Hangzhou, China – April 23–24, 2026 – The 2026 Beauty Technology & Industry Innovation Forum (PCT Hangzhou) will bring together leading scientists, R&D experts, and industry leaders to explore the next frontier of beauty innovation. The event will highlight breakthroughs in AI-driven ingredient discovery, mechanism-based skincare research, and innovative Chinese cosmetic raw materials.

interpack 2026: Sealpac on how to reduce packaging cost

With energy prices climbing, resources becoming scarce, costs tightening, and skilled workers in short supply, packaging lines have become more crucial to business decisions than ever. At interpack 2026 (at Stand D19, Hall 5), SEALPAC will demonstrate how its traysealers and thermoformers deliver cost savings in practice.

DRAM revenue surges 30% in Q4 2025 amid price rally

Aggressive additional orders have driven a sharp increase in conventional DRAM contract prices, lifting total DRAM industry revenue to $53.58 billion in 4Q 2025.

Extended OLED partnership strengthens display innovation

Universal Display has extended its long-term OLED material supply and license agreements with LG Display.

A female perspective on the food industry workplace

From ADM, Olive Tang, VP of Flavors, APAC, and Jingting Li, Talent Acquisition Director, APAC talk about their experiences, perspectives and the opportunities for women in the food industry.

Edge computing spend to hit $450B by 2029

Edge AI's impact is already visible across industrial automation, smart retail, connected vehicles, and next‑generation healthcare.

China drives global smartwatch growth in 2025

Global smartwatch shipments rebounded in 2025, growing by 4% year-on-year, according to Counterpoint Research.

200V BCD process boosts automotive & AI power ICs

A newly introduced 200V bipolar-CMOS-DMOS (BCD) process technology is designed to advance power ICs for automotive and AI applications. Supporting higher voltages with improved efficiency and reliability, it enables compact, high-performance solutions for electric vehicles, industrial systems, and AI hardware. By combining robust power handling with scalability, this innovation strengthens next-generation designs in mobility and intelligent electronics.

Next-gen vehicle architectures drive innovation

A new initiative is accelerating the development of next-generation vehicle electrical and electronic (E/E) architectures. Focused on software-defined vehicles, it enables greater integration, scalability, and efficiency across automotive systems. By supporting advanced connectivity, electrification, and autonomous features, this approach reduces complexity while enhancing performance, paving the way for smarter, safer, and more sustainable mobility solutions.

High-voltage gate driver advances power management

A new gate driver technology is engineered for high-voltage power management applications, delivering improved efficiency, reliability, and safety. Designed to handle demanding environments, it supports wide-bandgap devices like SiC and GaN, enabling faster switching speeds and reduced energy losses. With robust protection features and optimized performance, this innovation strengthens power systems across automotive, industrial, and renewable energy sectors.

Next-gen chip design and verification breakthroughs

A new frontier in semiconductor design and verification is emerging, driven by advanced tools that accelerate innovation and ensure reliability. This approach integrates AI, automation, and cloud-based collaboration to streamline complex chip development. By enhancing productivity, reducing errors, and enabling faster time-to-market, these technologies are reshaping how engineers create and validate the next generation of high-performance integrated circuits.