China is shaping the future, while Europe struggles with the past

MHP and Ludwig Maximilian University of Munich are publishing the eighth edition of the Industry 4.0 Barometer in conjunction with HANNOVER MESSE 2026—featuring alarming statistics, particularly for the DACH region.

Debut and Oterra to develop and scale biotech alternative to Red 40 for food and beverage

Debut, a pioneer in AI-powered biotech innovation, and Oterra, supplier of natural colors and color solutions for the food and beverage industry, announced a multi-million-dollar collaboration to develop and scale a natural alternative to artificial red colors for food and beverage applications.

South Edition: Tube & Pipe Fair 2026 Is Bigger, Better and Even More Business Focused!

SK Group signs MOUs to advance Vietnam’s AI ecosystem and infrastructure development

SK Group will collaborate with Vietnam to develop the country’s AI ecosystem and infrastructure.

TSMC launches A13 process and advanced technologies

A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture.

ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore

ATLANT 3D and NUS I-FIM are collaborating to build AI-driven, atomic-scale materials discovery foundry in Singapore.

Southeast Asia emerges as global data center hotspot as market set to hit US$14B by 2034

The Southeast Asia data center market is forecast to grow to US$14 billion by 2034, driven by cloud adoption amid exploding AI demand.

AI Chip boom powers double-digit growth in global electronic system design industry

ESD industry revenue increased by 10.3% year-on-year to $5.47 billion in the fourth quarter of 2025, according to the ESD Alliance.

AI infrastructure boom fuels rapid growth of the ‘Foundry 2.0’ semiconductor ecosystem

The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC.

Polyn Technology drives ultra-low-power automotive ai forward with neuromorphic chip tapeout

Polyn Technology has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring.

JEDEC pushes DDR5 memory performance to new heights with next-generation MRDIMM standards

The new DDR5 MRDIMM memory logic standards enable higher bandwidth scaling while JEDEC progresses next‑generation MRDIMM module designs.

GUC powers the next wave of AI Computing with advanced ASIC and chiplet technologies

Collaboration brings together flagship SoC design, optical I/O and rack-scale liquid-cooled system integration to help hyperscalers accelerate system-ready AI infrastructure.