From connected data to industrial intelligence

Artificial intelligence took centre stage at Siemens Realize LIVE Asia-Pacific 2026 in Bengaluru. Siemens executives outlined how industrial software is becoming more connected, contextual and capable of supporting decisions throughout the product lifecycle.

Designing the AI chip era

Ankur Gupta discusses soaring demand for AI chips, the pressure to improve engineering productivity, and the technologies shaping the future of semiconductor design.

Nuyarn® wins Performance Days Wool Award

Innovative open-net construction leverages cutting edge performance wool technology

Unilever Advances Virtual Skin Research, DermCosmos Explores AI for Cosmetics R&D and Evaluation

By connecting skin cell states, ingredient interventions and biological responses, this joint research initiative launched in China aims to make active ingredient screening and research into mechanisms of action more targeted, build scientific evidence for safety and efficacy evaluation, and explore new ways for AI to support regulatory science.

SHIBAURA MACHINE LWB | Next-Level Molding Days showcased 15 injection molding systems

The Linear LWB MultiStation paves the way for higher productivity in rubber manufacturing while reducing staffing requirements

Syensqo high-performance materials – from heart surgery implants

Syensqo works with medical-device manufacturers to develop high-performance materials that can meet demanding requirements of the medical field.

Renesas adds low-power RL78 MCU for smart appliance control

The 16-bit RL78/G21 targets appliance control with lower power consumption, while RL78/G23 adds capacitive-touch channels for HMIs.

Thailand targets US$80B in semiconductor investment by 2050

Thailand has approved its first national semiconductor and advanced electronics strategy, targeting approximately US$80 billion in cumulative investment, US$150 billion in annual industry revenue and more than 230,000 new jobs by 2050. The initiative aims to position the country as a higher-value manufacturing hub within the global semiconductor supply chain.

Wibu-Systems' award-winning CodeMeter ASIC advances embedded security and software protection

Wibu-Systems has received the KES Innovation Award 2026 in the Electronic Components & Materials category for its CodeMeter ASIC, recognizing the company's developments in hardware-based software protection, embedded security and licensing technology. The German cybersecurity specialist was the only German company among the 35 award-winning businesses.

Breaking the bottleneck in co-packaged optics with high-speed precision alignment

Aerotech's PICAlign, developed with Santec and SENKO, aims to change that by achieving high-precision multichannel alignment in under two seconds.

Siemens and NVIDIA bring AI-Powered PCB inspection into the virtual world

Siemens and NVIDIA are bringing AI-powered inspection into the virtual world, combining Digital Twin technology with NVIDIA Cosmos to transform electronics manufacturing.

Precision visibility for stable semiconductor manufacturing

Discover how Flir's thermal and acoustic imaging technologies help manufacturers identify leaks, monitor equipment conditions, improve process stability, and protect critical assets. Explore how smarter inspection and early detection can support more reliable and efficient fab operations.