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Global

TSMC launches A13 process and advanced technologies

TSMC launches A13 process and advanced technologies

A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2026-05-06 Taiwan Semiconductor Manufacturing Co. Ltd (TSMC)

ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore

ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore

ATLANT 3D and NUS I-FIM are collaborating to build AI-driven, atomic-scale materials discovery foundry in Singapore.

Semiconductor / Electronic Chip

2026-05-06 ATLANT 3D

Southeast Asia emerges as global data center hotspot as market set to hit US$14B by 2034

Southeast Asia emerges as global data center hotspot as market set to hit US$14B by 2034

The Southeast Asia data center market is forecast to grow to US$14 billion by 2034, driven by cloud adoption amid exploding AI demand.

Semiconductor / Electronic ChipSemiconductor Process Equipment Industry Updates

2026-05-06 IMARC Group

AI Chip boom powers double-digit growth in global electronic system design industry

AI Chip boom powers double-digit growth in global electronic system design industry

ESD industry revenue increased by 10.3% year-on-year to $5.47 billion in the fourth quarter of 2025, according to the ESD Alliance.

Semiconductor / Electronic Chip

2026-05-06 SEMI

AI infrastructure boom fuels rapid growth of the ‘Foundry 2.0’ semiconductor ecosystem

AI infrastructure boom fuels rapid growth of the ‘Foundry 2.0’ semiconductor ecosystem

The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2026-05-06 International Data Corp.

Polyn Technology drives ultra-low-power automotive ai forward with neuromorphic chip tapeout

Polyn Technology drives ultra-low-power automotive ai forward with neuromorphic chip tapeout

Polyn Technology has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring.

2026-05-06 Polyn Technology

JEDEC pushes DDR5 memory performance to new heights with next-generation MRDIMM standards

JEDEC pushes DDR5 memory performance to new heights with next-generation MRDIMM standards

The new DDR5 MRDIMM memory logic standards enable higher bandwidth scaling while JEDEC progresses next‑generation MRDIMM module designs.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2026-05-06 JEDEC Solid State Technology Association

GUC powers the next wave of AI Computing with advanced ASIC and chiplet technologies

GUC powers the next wave of AI Computing with advanced ASIC and chiplet technologies

Collaboration brings together flagship SoC design, optical I/O and rack-scale liquid-cooled system integration to help hyperscalers accelerate system-ready AI infrastructure.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2026-05-06 Global Unichip Corp. (GUC)

Arrow Electronics accelerates shift toward software-defined vehicles with new E/E architecture initiative

Arrow Electronics accelerates shift toward software-defined vehicles with new E/E architecture initiative

Arrow Electronics is positioning itself as a key enabler of next-generation mobility.

Semiconductor / Electronic Chip Automotive

2026-05-06 Arrow Electronics

Analog Devices expands semiconductor manufacturing network with new Thailand facility

Analog Devices expands semiconductor manufacturing network with new Thailand facility

Thailand plays a critical role in ADI's global manufacturing network, supporting long‑term growth by expanding the company's footprint with the resilience, flexibility and scale needed to serve customers across several markets.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2026-05-06

Producing high-quality regranulate efficiently

Producing high-quality regranulate efficiently

EREMA demonstrates at PRSE 2026 how advanced technologies and coordinated process chains enable the production of high-quality regranulates for demanding end use applications.

Plastics & RubberPlastics Recycling Tradeshow Preview/ReviewTechnology

2026-05-05 Erema

WACKER’s Polymers division under new leadership

WACKER’s Polymers division under new leadership

Maximilian Peter to take charge of the Polymers division starting May 1, 2026; Peter Summo, to take charge of Sales & Distribution

Plastics & Rubber Enterprise Closeup

2026-05-05 WACKER